Model RFP-250-50RM

Typical Performance

2

Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121

Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369

Power Derating

Suggested Mounting Procedures

MIN.

.025

(2 PLACES)

SUGGESTED STRESS RELIEF METHODS

BOARD LOWER

THAN LEAD.

WITH LEAD.

BOARD EVEN

SCALE:

1. Make sure that the devices are mounted on flat surfaces

(.001” under the device) to optimize the heat transfer.

2. Drill & tap the heatsink for the appropriate thread size to

be used.

3. Coat heatsink with a minimum amount of high quality

silicone grease (.001” max. thickness).

4. Position device on mounting surface and secure using

socket head screws, flat & split washers. Torque screws to

the appropriate value. Make sure that the device is flat

against the heatsink. (Care should be taken to avoid

upward pressure of the leads towards the lid).

5. Solder leads in place using an SN63 type solder with a

controlled temperature iron (210°C).

SCALE:

BOARD HIGHER

THAN LEAD.

THAN LEAD.

BOARD LOWER

NOT RECOMMENDED APPLICATION

CASE TEMPERATURE — °C

150

125

100

75

50

25

100

75

25

50

0