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74AC16373DLG4 Datasheet(PDF) 1 Page - Texas Instruments

Part # 74AC16373DLG4
Description  16-BIT TRANSPARENT D-TYPE LATCHES WITH 3-STATE OUTPUTS
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

74AC16373DLG4 Datasheet(HTML) 1 Page - Texas Instruments

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54AC16373, 74AC16373
16-BIT TRANSPARENT D-TYPE LATCHES
WITH 3-STATE OUTPUTS
SCAS121B – MARCH 1990 – REVISED APRIL 1996
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
D Members of the Texas Instruments
Widebus
™ Family
D 3-State True Outputs
D Full Parallel Access for Loading
D Flow-Through Architecture Optimizes
PCB Layout
D Distributed VCC and GND Pin Configuration
Minimizes High-Speed Switching Noise
D EPIC™ (Enhanced-Performance Implanted
CMOS) 1-
µm Process
D 500-mA Typical Latch-Up Immunity at
125
°C
D Package Options Include Plastic 300-mil
Shrink Small-Outline (DL) Packages Using
25-mil Center-to-Center Pin Spacings and
380-mil Fine-Pitch Ceramic Flat (WD)
Packages Using 25-mil Center-to-Center
Pin Spacings
description
The ’AC16373 are 16-bit transparent D-type
latches with 3-state outputs designed specifically
for
driving
highly
capacitive
or
relatively
low-impedance loads. They are particularly
suitable for implementing buffer registers, I/O
ports, bidirectional bus drivers, and working
registers. The device can be used as two 8-bit
latches or one 16-bit latch. When the latch-enable
(LE) input is high, the Q outputs follow the data (D)
inputs. When LE is taken low, the Q outputs are
latched at the levels set up at the D inputs.
A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high
or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive
the bus lines significantly. The high-impedance state and the increased drive provide the capability to drive bus
lines without need for interface or pullup components. OE does not affect internal operations of the latch. Old
data can be retained or new data can be entered while the outputs are in the high-impedance state.
The 74AC16373 is packaged in TI’s shrink small-outline package (DL), which provides twice the I/O pin count
and functionality of standard small-outline packages in the same printed-circuit-board area.
The 54AC16373 is characterized for operation over the full military temperature range of –55
°C to 125°C. The
74AC16373 is characterized for operation from –40
°C to 85°C.
Copyright
© 1996, Texas Instruments Incorporated
UNLESS OTHERWISE NOTED this document contains PRODUCTION
DATA information current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all
parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
EPIC and Widebus are trademarks of Texas Instruments Incorporated.
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1OE
1Q1
1Q2
GND
1Q3
1Q4
VCC
1Q5
1Q6
GND
1Q7
1Q8
2Q1
2Q2
GND
2Q3
2Q4
VCC
2Q5
2Q6
GND
2Q7
2Q8
2OE
1LE
1D1
1D2
GND
1D3
1D4
VCC
1D5
1D6
GND
1D7
1D8
2D1
2D2
GND
2D3
2D4
VCC
2D5
2D6
GND
2D7
2D8
2LE
54AC16373 . . . WD PACKAGE
74AC16373 . . . DL PACKAGE
(TOP VIEW)


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