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IRFZ44NSPBF Datasheet(PDF) 2 Page - International Rectifier

Part No. IRFZ44NSPBF
Description  HEXFET®Power MOSFET
Download  11 Pages
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Maker  IRF [International Rectifier]
Homepage  http://www.irf.com
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IRFZ44NSPBF Datasheet(HTML) 2 Page - International Rectifier

 
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IRFZ44NS/LPbF
2
www.irf.com
** When mounted on 1" square PCB (FR-4 or G-10 Material ).
For recommended footprint and soldering techniques refer to application note #AN-994.
S
D
G
Parameter
Min. Typ. Max. Units
Conditions
IS
Continuous Source Current
MOSFET symbol
(Body Diode)
–––
–––
showing the
ISM
Pulsed Source Current
integral reverse
(Body Diode)

–––
–––
p-n junction diode.
VSD
Diode Forward Voltage
–––
–––
1.3
V
TJ = 25°C, IS = 25A, VGS = 0V
„
trr
Reverse Recovery Time
–––
63
95
ns
TJ = 25°C, IF = 25A
Qrr
Reverse Recovery Charge
–––
170 260
nC
di/dt = 100A/µs
„
ton
Forward Turn-On Time
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Source-Drain Ratings and Characteristics
49
160
A
‚ Starting TJ = 25°C, L = 0.48mH
RG = 25Ω, IAS = 25A. (See Figure 12)
 Repetitive rating; pulse width limited by
max. junction temperature. (See fig. 11)
Notes:
ƒ ISD ≤ 25A, di/dt ≤ 230A/µs, VDD ≤ V(BR)DSS,
TJ ≤ 175°C
„ Pulse width ≤ 400µs; duty cycle ≤ 2%.
… This is a typical value at device destruction and represents
operation outside rated limits.
† This is a calculated value limited to TJ = 175°C .
Parameter
Min. Typ. Max. Units
Conditions
V(BR)DSS
Drain-to-Source Breakdown Voltage
55
–––
–––
V
VGS = 0V, ID = 250µA
∆V(BR)DSS/∆TJ Breakdown Voltage Temp. Coefficient
––– 0.058 –––
V/°C Reference to 25°C, ID = 1mA
RDS(on)
Static Drain-to-Source On-Resistance –––
––– 17.5
m
VGS = 10V, ID = 25A
„
VGS(th)
Gate Threshold Voltage
2.0
–––
4.0
V
VDS = VGS, ID = 250µA
gfs
Forward Transconductance
19
–––
–––
S
VDS = 25V, ID = 25A
„
–––
–––
25
µA
VDS = 55V, VGS = 0V
–––
–––
250
VDS = 44V, VGS = 0V, TJ = 150°C
Gate-to-Source Forward Leakage
–––
–––
100
VGS = 20V
Gate-to-Source Reverse Leakage
–––
––– -100
nA
VGS = -20V
Qg
Total Gate Charge
–––
–––
63
ID = 25A
Qgs
Gate-to-Source Charge
–––
–––
14
nC
VDS = 44V
Qgd
Gate-to-Drain ("Miller") Charge
–––
–––
23
VGS = 10V, See Fig. 6 and 13
td(on)
Turn-On Delay Time
–––
12
–––
VDD = 28V
tr
Rise Time
–––
60
–––
ID = 25A
td(off)
Turn-Off Delay Time
–––
44
–––
RG = 12Ω
tf
Fall Time
–––
45
–––
VGS = 10V, See Fig. 10
„
LS
Internal Source Inductance
–––
7.5
–––
nH
Between lead,
and center of die contact
Ciss
Input Capacitance
––– 1470 –––
VGS = 0V
Coss
Output Capacitance
–––
360
–––
VDS = 25V
Crss
Reverse Transfer Capacitance
–––
88
–––
pF
ƒ = 1.0MHz, See Fig. 5
EAS
Single Pulse Avalanche Energy
‚
––– 530
… 150† mJ
IAS = 25A, L = 0.47mH
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
IGSS
ns
IDSS
Drain-to-Source Leakage Current


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