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HLMP-CW70-LP0XX Datasheet(PDF) 5 Page - AVAGO TECHNOLOGIES LIMITED |
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HLMP-CW70-LP0XX Datasheet(HTML) 5 Page - AVAGO TECHNOLOGIES LIMITED |
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5 / 6 page  5 Wave Soldering Manual Solder Dipping Pre-heat temperature 105 °C Max. - Preheat time 30 sec Max - Peak temperature 250 °C Max. 260 °C Max. Dwell time 3 sec Max. 5 sec Max BOTTOM SIDE OF PC BOARD TOP SIDE OF PC BOARD NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150 C (100 C PCB) SOLDER WAVE TEMPERATURE = 5 C AIR KNIFE AIR TEMPERATURE = 390 C AIR KNIFE DISTANCE = 1.91 mm (0.5 IN.) AIR KNIFE ANGLE = 0 SOLDER: SN63; FLUX: RMA 50 00 150 FLUXING TURBULENT WAVE PREHEAT TIME - SECONDS 100 50 30 0 10 0 30 0 50 60 70 80 90 100 LAMINAR WAVE HOT AIR KNIFE LED component lead size Diagonal Plated through hole diameter 0.457 x 0.457mm (0.025 inch) 0.646 mm (0.038 to 0.042 inch) (0.018 x 0.018inch) 0.976 to 1.078 mm 0.508 x 0.508mm (0.028 inch) 0.718 mm (0.041 to 0.045 inch (0.020 x 0.020inch) 1.049 to 1.150mm Precautions: Lead Forming: • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. • If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will ab- sorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. • It is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. Soldering Condition: • Care must be taken during PCB assembly and solder- ing process to prevent damage to LED component. • The closest LED is allowed to solder on board is 1.59mm below the body (encapsulant epoxy) for those parts without standoff. • Recommended soldering condition: Recommended Wave Soldering Profile Note: Refer to application note AN1027 for more information on sol- dering LED components. • Wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the solder wave. Customer is advised to pe- riodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. • If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. • Proper handling is imperative to avoid excessive thermal stresses to LED components when heated. Therefore, the soldered PCB must be allowed to cool to room temperature, 25°C before handling. • Special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. • Recommended PC board plated through holes size for LED component leads. |
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