HSDL-9001 datasheet(6/12 Pages) AVAGO

Part #	HSDL-9001

Description	Miniature Surface-Mount Ambient Light Photo Diode

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Manufacturer	AVAGO [AVAGO TECHNOLOGIES LIMITED]

Direct Link	http://www.avagotech.com

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6 / 12 page

6

Moisture Proof Packaging

All HSDL-9001 options are

shipped in moisture proof

package. Once opened, moisture

absorption begins.

This part is compliant to JEDEC

Level 2a.

Baking Conditions

If the parts are not stored in dry

conditions, they must be baked

before reflow to prevent damage

to the parts.

Package

Temp.

Time

In reels

60

°C

20 hours

In bulk

125

°C3 hours

Baking should only be done once.

Recommended Storage Conditions

Storage Temperature

10

°C to 30°C

Relative Humidity

below

60% RH

Time from Unsealing to Soldering

After removal from the bag, the

parts should be soldered within

three days if stored at the

recommended storage conditions.

If times longer than four weeks

are needed, the parts must be

stored in a dry box.

Figure 5. Baking conditions chart.

UNITS IN A SEALED

MOISTURE-PROOF

PACKAGE

PACKAGE IS

OPENED (UNSEALED)

ENVIRONMENT

LESS THAN 30

°C,

AND LESS THAN

60% RH

PACKAGE IS

OPENED LESS

THAN 672 HOURS

PERFORM RECOMMENDED

BAKING CONDITIONS

NO BAKING

IS NECESSARY

YES

NO

YES

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HSDL-9001 Datasheet(PDF) 6 Page - AVAGO TECHNOLOGIES LIMITED

HSDL-9001 Datasheet(HTML) 6 Page - AVAGO TECHNOLOGIES LIMITED

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