© 2006 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FAN5109B Rev. 1.0.0

4 of 14

Absolute Maximum Ratings

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be

operable above the recommended operating conditions and stressing the parts to these levels is not recommended.

In addition, extended exposure to stresses above the recommended operating conditions may affect device

reliability. The absolute maximum ratings are stress ratings only.

Parameter

Min

.

Max

.

Unit

VCC and LDRV to GND

-0.3

15.0

V

-0.3

5.5

V

Continuous

-1.0

15.0

V

SW to GND

Transient (t=100ns, f = 500kHz)

(2)

-5.0

25.0

V

Continuous

-0.3

15.0

V

BOOT to SW

Transient (t<20ns, f = 500kHz)

-2.0

17.0

V

Continuous

-0.3

30.0

V

BOOT to GND

Transient (t=100ns, f =500kHz)

38.0

V

HDRV

V

Continuous

-0.5

V

Transient (t=200ns)

(2)

-2.0

V

LDRV

Transient (t<20ns, f = 500kHz)

(2)

-2.0

V

Note:

2.

For transient derating beyond the levels indicated, refer to Figure 17 and Figure 18.

Thermal Information

Symbol

Parameter

Min

.

Typ

.

Max

.

Unit

Junction Temperature

0

150

°C

Storage Temperature

-65

150

°C

Lead Soldering Temperature, 10 seconds

300

°C

Vapor Phase, 60 seconds

215

°C

Infrared, 15 seconds

220

°C

715

mW

Thermal Resistance, SO-8: Junction-to-Case

40

°C/W

Thermal Resistance, SO-8: Junction-to-Ambient

140

°C/W

Recommended Operating Conditions

The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended

operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not

recommend exceeding them or designing to Absolute Maximum Ratings.

Symbol

Parameter

Conditions

Min

.

Typ

.

Max

.

Unit

Supply Voltage

VCC to GND

10.0

12.0

13.5

V

Ambient Temperature

0

85

°C

Junction Temperature

0

125

°C