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TSL2550 Datasheet(PDF) 18 Page - TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS

Part No. TSL2550
Description  AMBIENT LIGHT SENSOR WITH SMBus INTERFACE
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Manufacturer  TAOS [TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS]
Direct Link  http://www.taosinc.com
Logo TAOS - TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS

TSL2550 Datasheet(HTML) 18 Page - TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS

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TSL2550
AMBIENT LIGHT SENSOR
WITH SMBus INTERFACE
TAOS029L − OCTOBER 2007
18
r
r
Copyright E 2007, TAOS Inc.
The LUMENOLOGY r Company
www.taosinc.com
MANUFACTURING INFORMATION
Moisture Sensitivity
Optical characteristics of the device can be adversely affected during the soldering process by the release and
vaporization of moisture that has been previously absorbed into the package molding compound.
Package D
To ensure the package molding compound contains the smallest amount of absorbed moisture possible, all
devices shipped in carrier tape have been pre-baked and shipped in a sealed moisture-barrier bag. No further
action is necessary if these devices are processed through solder reflow within 24 hours of the seal being broken
on the moisture-barrier bag.
However, for all devices shipped in tubes or if the seal on the moisture barrier bag has been broken for 24 hours
or longer, it is recommended that the following procedures be used to ensure the package molding compound
contains the smallest amount of absorbed moisture possible.
For devices shipped in tubes:
1. Remove devices from tubes
2. Bake devices for 4 hours, at 90°C
3. After cooling, load devices back into tubes
4. Perform solder reflow within 24 hours after bake
Bake only a quantity of devices that can be processed through solder reflow in 24 hours. Devices can be
re-baked for 4 hours, at 90°C for a cumulative total of 12 hours (3 bakes for 4 hours at 90°C).
For devices shipped in carrier tape:
1. Bake devices for 4 hours, at 90°C in the tape
2. Perform solder reflow within 24 hours after bake
Bake only a quantity of devices that can be processed through solder reflow in 24 hours. Devices can be
re−baked for 4 hours in tape, at 90°C for a cumulative total of 12 hours (3 bakes for 4 hours at 90°C).
Package T
To ensure the package molding compound contains the smallest amount of absorbed moisture possible, each
device is dry-baked prior to being packed for shipping. Devices are packed in a sealed aluminized envelope
with silica gel to protect them from ambient moisture during shipping, handling, and storage before use.
The T package has been assigned a moisture sensitivity level of MSL 3 and the devices should be stored under
the following conditions:
Temperature Range
5°C to 50°C
Relative Humidity
60% maximum
Total Time
6 months from the date code on the aluminized envelope — if unopened
Opened Time
168 hours or fewer
Rebaking will be required if the devices have been stored unopened for more than 6 months or if the aluminized
envelope has been open for more than 168 hours. If rebaking is required, it should be done at 90°C for 4 hours.


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