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TSL2550 Datasheet(PDF) 18 Page - TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS |
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TSL2550 Datasheet(HTML) 18 Page - TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS |
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18 / 20 page  TSL2550 AMBIENT LIGHT SENSOR WITH SMBus INTERFACE TAOS029L − OCTOBER 2007 18 r r Copyright E 2007, TAOS Inc. The LUMENOLOGY r Company www.taosinc.com MANUFACTURING INFORMATION Moisture Sensitivity Optical characteristics of the device can be adversely affected during the soldering process by the release and vaporization of moisture that has been previously absorbed into the package molding compound. Package D To ensure the package molding compound contains the smallest amount of absorbed moisture possible, all devices shipped in carrier tape have been pre-baked and shipped in a sealed moisture-barrier bag. No further action is necessary if these devices are processed through solder reflow within 24 hours of the seal being broken on the moisture-barrier bag. However, for all devices shipped in tubes or if the seal on the moisture barrier bag has been broken for 24 hours or longer, it is recommended that the following procedures be used to ensure the package molding compound contains the smallest amount of absorbed moisture possible. For devices shipped in tubes: 1. Remove devices from tubes 2. Bake devices for 4 hours, at 90°C 3. After cooling, load devices back into tubes 4. Perform solder reflow within 24 hours after bake Bake only a quantity of devices that can be processed through solder reflow in 24 hours. Devices can be re-baked for 4 hours, at 90°C for a cumulative total of 12 hours (3 bakes for 4 hours at 90°C). For devices shipped in carrier tape: 1. Bake devices for 4 hours, at 90°C in the tape 2. Perform solder reflow within 24 hours after bake Bake only a quantity of devices that can be processed through solder reflow in 24 hours. Devices can be re−baked for 4 hours in tape, at 90°C for a cumulative total of 12 hours (3 bakes for 4 hours at 90°C). Package T To ensure the package molding compound contains the smallest amount of absorbed moisture possible, each device is dry-baked prior to being packed for shipping. Devices are packed in a sealed aluminized envelope with silica gel to protect them from ambient moisture during shipping, handling, and storage before use. The T package has been assigned a moisture sensitivity level of MSL 3 and the devices should be stored under the following conditions: Temperature Range 5°C to 50°C Relative Humidity 60% maximum Total Time 6 months from the date code on the aluminized envelope — if unopened Opened Time 168 hours or fewer Rebaking will be required if the devices have been stored unopened for more than 6 months or if the aluminized envelope has been open for more than 168 hours. If rebaking is required, it should be done at 90°C for 4 hours. |
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