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TSL2550 Datasheet(PDF) 17 Page - TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS

Part No. TSL2550
Description  AMBIENT LIGHT SENSOR WITH SMBus INTERFACE
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Manufacturer  TAOS [TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS]
Direct Link  http://www.taosinc.com
Logo TAOS - TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS

TSL2550 Datasheet(HTML) 17 Page - TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS

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TSL2550
AMBIENT LIGHT SENSOR
WITH SMBus INTERFACE
TAOS029L − OCTOBER 2007
17
The LUMENOLOGY r Company
r
r
Copyright E 2007, TAOS Inc.
www.taosinc.com
MANUFACTURING INFORMATION
The D and T packages have been tested and have demonstrated an ability to be reflow soldered to a PCB
substrate. The process, equipment, and materials used in these test are detailed below.
The solder reflow profile describes the expected maximum heat exposure of components during the solder
reflow process of product on a PCB. Temperature is measured on top of component. The components should
be limited to a maximum of three passes through this solder reflow profile.
Table 5. TSL2550 Solder Reflow Profile
PARAMETER
REFERENCE
TSL2550D/TSL2550T
Average temperature gradient in preheating
2.5°C/sec
Soak time
tsoak
2 to 3 minutes
Time above 217°C
t1
Max 60 sec
Time above 230°C
t2
Max 50 sec
Time above Tpeak −10°C
t3
Max 10 sec
Peak temperature in reflow
Tpeak
260° C (−0°C/+5°C)
Temperature gradient in cooling
Max −5°C/sec
t3
t2
t1
tsoak
T3
T2
T1
Tpeak
Not to scale — for reference only
Time (sec)
Figure 14. TSL2550D/TSL2550T Solder Reflow Profile Graph


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