TSL238

HIGH-SENSITIVITY

LIGHT-TO-FREQUENCY CONVERTER

TAOS073F − OCTOBER 2007

10

r

r

Copyright E 2007, TAOS Inc.

The LUMENOLOGY r Company

www.taosinc.com

MANUFACTURING INFORMATION

The Plastic Small Outline IC package (D) has been tested and has demonstrated an ability to be reflow soldered

to a PCB substrate.

The solder reflow profile describes the expected maximum heat exposure of components during the solder

reflow process of product on a PCB. Temperature is measured on top of component. The component should

be limited to a maximum of three passes through this solder reflow profile.

Table 1. TSL238 Solder Reflow Profile

PARAMETER

REFERENCE

TSL238

Average temperature gradient in preheating

2.5°C/sec

Soak time

2 to 3 minutes

Time above 217°C

Max 60 sec

Time above 230°C

Max 50 sec

Max 10 sec

Peak temperature in reflow

260° C (−0°C/+5°C)

Temperature gradient in cooling

Max −5°C/sec

Not to scale — for reference only

Time (sec)

Figure 10. Solder Reflow Profile Graph