Electronic Components Datasheet Search |
|
TSL238 Datasheet(PDF) 10 Page - TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS |
|
TSL238 Datasheet(HTML) 10 Page - TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS |
10 / 12 page TSL238 HIGH-SENSITIVITY LIGHT-TO-FREQUENCY CONVERTER TAOS073F − OCTOBER 2007 10 r r Copyright E 2007, TAOS Inc. The LUMENOLOGY r Company www.taosinc.com MANUFACTURING INFORMATION The Plastic Small Outline IC package (D) has been tested and has demonstrated an ability to be reflow soldered to a PCB substrate. The solder reflow profile describes the expected maximum heat exposure of components during the solder reflow process of product on a PCB. Temperature is measured on top of component. The component should be limited to a maximum of three passes through this solder reflow profile. Table 1. TSL238 Solder Reflow Profile PARAMETER REFERENCE TSL238 Average temperature gradient in preheating 2.5°C/sec Soak time tsoak 2 to 3 minutes Time above 217°C t1 Max 60 sec Time above 230°C t2 Max 50 sec Time above Tpeak −10°C t3 Max 10 sec Peak temperature in reflow Tpeak 260° C (−0°C/+5°C) Temperature gradient in cooling Max −5°C/sec t3 t2 t1 tsoak T3 T2 T1 Tpeak Not to scale — for reference only Time (sec) Figure 10. Solder Reflow Profile Graph |
Similar Part No. - TSL238 |
|
Similar Description - TSL238 |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.COM |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Datasheet Upload | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |