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CPGA Datasheet(PDF) 1 Page - Amkor Technology

Part # CPGA
Description  Ceramic Pin Grid Array Package
Download  1 Pages
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Manufacturer  AMKOR [Amkor Technology]
Direct Link  http://www.amkor.com
Logo AMKOR - Amkor Technology

CPGA Datasheet(HTML) 1 Page - Amkor Technology

  CPGA Datasheet HTML 1Page - Amkor Technology  
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data sheet
CPGA
Features:
CERAMIC
/ HERMETIC
www.amkor.com
VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND
TO VIEW THE MOST CURRENT PRODUCT INFORMATION
Ceramic Pin Grid Array
Package (CPGA)
Amkor Technology is committed to continuing to
service this long established standard industry
package. This thru-hole package consists of a
co-fired ceramic base that has a matrix of pins
brazed onto the bottom of the base. The lid for
this package can be either ceramic "frit sealed" or
metal "solder sealed". The package can be
designed for either cavity up or cavity down
configurations. This IC package technology allows
application and design engineers to maximize the
performance characteristics of semiconductors
(silicon & GaAs). CPGAs are designed for low
inductance, enhanced thermal operation and
capability. Custom performance enhancements are
available for significant improvements in electrical
response demanded by advancing electronics.
Applications:
Semiconductor technologies find enhanced
performance by using the integrated design
features of the CPGA package. Microprocessors /
controllers, ASICs, Gate Arrays, memory, DSPs and
PC chip sets find the CPGA family to be an ideal
package. Applications requiring improved thermal
performance and high-speed performance such as
desk PCs, laptop PC's, and other similar products
benefit from the CPGA attributes.
The CPGA offers a variety of features. From
innovative designs and expanding package
offerings, Amkor provides a platform from
prototype-to-production.
• Flexible pin counts
• Variety of body sizes
• 50 mil & 100 mil pin pitch
• Staggered and full pin array matrix
• Heat plate / heat slug / heat sink
• Exceptional thermal and electrical performance
by design
• Multi-layer, ground / power
• Cavity Up and Cavity Down configurations
available
• Cavity package
DS805
Rev Date: 08’02
.


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