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CABGA Datasheet(PDF) 1 Page - Amkor Technology |
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CABGA Datasheet(HTML) 1 Page - Amkor Technology |
1 / 2 page data sheet CABGA/CTBGA/CVBGA Features: Thermal Resistance: Reliability: Cutting edge technology and expanding package offerings provide a platform from prototype-to-production. • Full, in-house design • Square or rectangle packages available • 4 mm to 21 mm body size available • 8 to 449 ball counts • 0.5, 0.65, 0.75, 0.80 & 1.0 mm ball pitch available • JEDEC MO-216 compliant for 0.8 mm and 1.0 mm ball pitch • JEDEC MO-195 compliant for 0.5 mm & 0.65 mm ball pitch • PB free and Green package available • Daisy Chain packages available • Short traces for excellent electrical inductance • Low inductance (modeled data) 1.4nH (1.0 mm trace length) 4.1nH (5.0 mm trace length) Theta JA at 1.0 Watt and 0 airflow (°C/Watt) CABGA CTBGA CVBGA 8 x 8 37.28 36.45 37.52 10 x 10 19.86 29.04 26.7 11 x 11 29 N/A N/A 15 x 15 20.1 N/A N/A 19 x 19 17.04 N/A N/A Amkor assures reliable performance by continuously monitoring key indices: • Moisture sensitivity JEDEC Level 2 @ 240 °C characterization JEDEC Level 3 @ 260 °C 85 °C/85% RH, 168 hours • Temp/humidity 85 °C/85%, 1000 hours • High temp storage 150 °C, 1000 hours • HAST 130 °C/85% RH, 96 hours • Temp cycle -55/+125 °C, 1000 cycles ChipArray® Packages: Amkor’s ChipArray® packages are laminate- based Ball Grid Array (BGA) packages that are compatible with established SMT mounting processes. The near-chip-size standard outlines offer a broad selection of ball array pitch, count, and body sizes. (See table on back.) In addition to the standard core ChipArray package (CABGA), Amkor offers thin core ball grid array packages (CTBGA and CVBGA) which, coupled with a thin mold cap, achieve package thicknesses down to 1.0 mm max. By utilizing a thin core laminate, much denser routing can be achieved, thereby enabling more I/Os in a given footprint. Amkor ChipArray packages, regardless of body size and thickness, utilize the same, flexible capacity which assures economical packaging solutions. Further, high volume processes and innovative design assure high quality and cutting edge technology. Due to their small size and I/O density, Amkor’s ChipArray product family is an excellent choice for new devices requiring a small footprint size and low mounted height. Applications: The ChipArray package family is applicable for semiconductors such as memory, analog, ASICs, RF devices and simple PLDs requiring a smaller package size than conventional PBGAs. ChipArray packages fill the need for low cost, minimum space and high speed requirements of mobile phones and pagers, notebook and subnotebook personal computers, PDAs and other wireless systems. LAMINATE www.amkor.com VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND TO VIEW THE MOST CURRENT PRODUCT INFORMATION . DS550N Rev Date: 01’07 |
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