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SMP1304 Datasheet(PDF) 4 Page - Skyworks Solutions Inc.

Part No. SMP1304
Description  Low-Distortion Attenuator Plastic Packaged PIN Diodes
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Maker  SKYWORKS [Skyworks Solutions Inc.]
Homepage  http://www.skyworksinc.com
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SMP1304 Datasheet(HTML) 4 Page - Skyworks Solutions Inc.

   
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Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
February 23, 2006 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice. • 200044 Rev. C
DATA SHEET • SMP1304 SERIES
4
4
31
2
43
12
SMP1304-019 (PI)
SMP1304-007
In the -007 configuration of the SOT-23 package, the package
inductance is effectively reduced to 0.4 nH, in comparison to the
1.5 nH value of the standard configuration. This lower inductance
will be particularly beneficial when the diodes are used as shunt
connected switches at frequencies higher than 500 MHz, where
inductance is the primary limitation on maximum switch isola-
tion. To achieve the effective 0.4 nH, the SOT-23 package must
be inserted in the microstrip circuit board with a gap in the trace,
as shown in the figure. Because of the polarity of the diode junc-
tion, this low inductance feature is realizable only with the
cathode connected to ground.
SMP1304-019 PI Attenuator PIN Diodes
The SMP1304-019 employs three PIN diode junctions in a
SOT-143 package. They are configured for ease of insertion in
PI attenuator circuits commonly used from 10 MHz to beyond
1 GHz. The SMP1304 PIN diode junction was designed for low
capacitance, wide resistance dynamic range, and low distortion
performance.
RR
R
R
R
IF
-55 °C
-15 °C
25 °C
65 °C
100 °C
(mA)
(
Ω)(Ω
Ω)(Ω
Ω)(Ω
Ω)(Ω
Ω)
0.02
1590
1660
1752
1770
1760
0.1
315
340
367
396
409
0.3
108
118
128
141
147
1
34.5
37.9
41.6
46.3
48.8
10
4.8
5.3
5.8
6.6
7
20
3
3.3
3.6
4.1
4.3
100
1.3
1.4
1.5
1.7
1.8
Resistance vs. Temperature @ 100 MHz
Ground
Gap
Recommended Solder Reflow Profiles
Refer to the “Recommended Solder Reflow Profile”
Application Note.
Tape and Reel Information
Refer to the “Discrete Devices and IC Switch/Attenuators
Tape and Reel Package Orientation” Application Note.


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