DATA SHEET • SKY77162

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

200005A2 • Skyworks Proprietary and Confidential information. • Products and product information are subject to change without notice. • May 2, 2006

11

VCC1

RF_IN

VCONT

VREF

GND

GND

RF_OUT

VCC2

200005_013

Pad layout as seen from top view looking through the package.

GROUND PAD is package underside.

1

2

3

4

5

6

7

8

GROUND PAD

Figure 13. SKY77162 Pad Configuration and Pad Names (Top

View)

200005_014

77162-N

NNNNN.N

YYWW MX

Revision

Number

Pin 1

Identifier

Lot Number

Country Code

Manufacturing

Part Number

Year

Manufactured

Week

Package

Sealed

Figure 14. Typical Case Markings

Package and Handling Information

Because of its sensitivity to moisture absorption, this device

package is baked and vacuum-packed prior to shipment.

Instructions on the shipping container label must be followed

regarding exposure to moisture after the container seal is broken,

otherwise, problems related to moisture absorption may occur

when the part is subjected to high temperature during solder

assembly.

The SKY77162 is capable of withstanding an MSL3/250 °C solder

reflow. Care must be taken when attaching this product, whether

it is done manually or in a production solder reflow environment.

If the part is attached in a reflow oven, the temperature ramp rate

should not exceed 3 °C per second; maximum temperature

should not exceed 250 °C. If the part is manually attached,

precaution should be taken to insure that the part is not subjected

to temperatures exceeding 250 °C for more than 10 seconds. For

details on both attachment techniques, precautions, and handling

procedures recommended by Skyworks, please refer to Skyworks

Application Note: PCB Design and SMT Assembly/Rework,

Document Number 101752. Additional information on standard

SMT reflow profiles can also be found in the JEDEC Standard

J-STD–020.

Production quantities of this product are shipped in the standard

tape-and-reel format. For packaging details, refer to Skyworks

Application Note: Tape and Reel – RF Modules, Document

Number 101568.

Electrostatic Discharge Sensitivity

Discharge (ESD) immunity level for each non-ground pad of the

threshold level for each pad where the I-V curve between the pad

and ground starts to show degradation.

The ESD testing was performed in compliance with

MIL-STD-883E Method 3015.7 using the Human Body Model. If

ESD damage threshold magnitude is found to consistently exceed

2000 volts on a given pad, this so is indicated. If ESD damage

threshold below 2000 volts is measured for either polarity,

numbers are indicated that represent worst case values observed

in product characterization.

Various failure criteria can be utilized when performing ESD

testing. Many vendors employ relaxed ESD failure standards,

which fail devices only after “the pad fails the electrical

specification limits” or “the pad becomes completely non-

functional”. Skyworks employs most stringent criteria and fails

devices as soon as the pad begins to show any degradation on a

curve tracer.

To avoid ESD damage, both latent and visible, it is very important

that the product assembly and test areas follow the Class-1 ESD

200005_014

VCC1

> + 2 kV

< – 2 kV

VCONT

> + 2 kV

< – 2 kV

VREF

> + 2 kV

< – 2 kV

RF_OUT

> + 2 kV

< – 2 kV

VCC2

> + 2 kV

< – 2 kV

RF_IN

> + 2 kV

< – 2 kV

1

2

3

4

5

6

7

8

GROUND PAD

Pad layout as seen from top view looking through the package.

Pad layout as seen from top view looking through the package.

GND

GND

Figure 15. ESD Sensitivity Areas (Top View)