MITSUBISHI SEMICONDUCTOR <Dual-In-Line Package Intelligent Power Module>

PS21962-ST

TRANSFER-MOLD TYPE

INSULATED TYPE

Mar. 2007

8

Bootstrap negative electrodes

should be connected to U, V,

W terminals directly and

separated from the main output

wires.

DIP-IPM

C3

C2

C2

C1

C1

C2 C1

15V line

5V line

COM

CIN

GND

F

o

C

A

CIN

NW

NV

NU

W

V

U

P

Fo

C3

HVIC

LVIC

M

Long wiring here might

cause short-circuit.

Long wiring here might cause

SC level fluctuation and

malfunction.

Long GND wiring here might

generate noise to input and

cause IGBT malfunction.

Comparator

C4

R1

B

Vref

C4

R1

B

Vref

C4

N1

R1

B

Vref

OR Logic

External protection circuit

Shunt resistors

-

+

-

+

-

+

Note 1 : Input drive is High-Active type. There is a 3.3kΩ(min.) pull-down resistor integrated in the IC input circuit. To prevent malfunction, the wiring of each in-

put should be as short as possible. When using RC coupling circuit, make sure the input signal level meet the turn-on and turn-off threshold voltage.

2: Thanks to HVIC inside the module, direct coupling to MCU without any opto-coupler or transformer isolation is possible.

4: To prevent erroneous protection, the wiring of A, B, C should be as short as possible.

5: The time constant R1C4 of the protection circuit should be selected in the range of 1.5-2µs. SC interrupting time might vary with the

wiring pattern. Tight tolerance, temp-compensated type is recommended for R1, C4.

6: All capacitors should be mounted as close to the terminals of the DIP-IPM as possible. (C1: good temperature, frequency character-

istic electrolytic type, and C2, C3: good temperature, frequency and DC bias characteristic ceramic type are recommended.)

7: To prevent surge destruction, the wiring between the smoothing capacitor and the P, N1 terminals should be as short as possible.

Generally a 0.1-0.22µF snubber between the P-N1 terminals is recommended.

leave another one open.

9: It is recommended to insert a Zener diode (24V/1W) between each pair of control supply terminals to prevent surge destruction.

10 : If control GND is connected to power GND by broad pattern, it may cause malfunction by power GND fluctuation. It is recommended

to connect control GND and power GND at only a point.

11 : The reference voltage Vref of comparator should be set up the same rating of short circuit trip level (Vsc(ref): min.0.43V to max.0.53V).

12 : OR logic output high level should exceed the maximum short circuit trip level (Vsc(ref): max.0.53V).

Fig. 6 AN EXAMPLE OF TYPICAL DIP-IPM APPLICATION CIRCUIT

C1: Electrolytic capacitor with good temperature characteristics

C2,C3: 0.22~2µF R-category ceramic capacitor for noise filtering