PACKAGING INFORMATION

Orderable Device

Status

(1)

Package

Type

Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

MSL Peak Temp

(3)

OPA130PA

OBSOLETE

PDIP

P

8

TBD

Call TI

Call TI

OPA130UA

ACTIVE

SOIC

D

8

100

Pb-Free

(RoHS)

CU NIPDAU

Level-3-260C-168 HR

OPA130UA/2K5

ACTIVE

SOIC

D

8

2500

Pb-Free

(RoHS)

CU NIPDAU

Level-3-260C-168 HR

OPA130UA/2K5E4

ACTIVE

SOIC

D

8

2500

Pb-Free

(RoHS)

CU NIPDAU

Level-3-260C-168 HR

OPA130UAE4

ACTIVE

SOIC

D

8

100

Pb-Free

(RoHS)

CU NIPDAU

Level-3-260C-168 HR

OPA2130PA

OBSOLETE

PDIP

P

8

TBD

Call TI

Call TI

OPA2130UA

ACTIVE

SOIC

D

8

100

Pb-Free

(RoHS)

CU NIPDAU

Level-3-260C-168 HR

OPA2130UA/2K5

ACTIVE

SOIC

D

8

2500

Pb-Free

(RoHS)

CU NIPDAU

Level-3-260C-168 HR

OPA2130UA/2K5E4

ACTIVE

SOIC

D

8

2500

Pb-Free

(RoHS)

CU NIPDAU

Level-3-260C-168 HR

OPA2130UAE4

ACTIVE

SOIC

D

8

100

Pb-Free

(RoHS)

CU NIPDAU

Level-3-260C-168 HR

OPA4130PA

OBSOLETE

PDIP

N

14

TBD

Call TI

Call TI

OPA4130UA

ACTIVE

SOIC

D

14

58

Pb-Free

(RoHS)

CU NIPDAU

Level-3-260C-168 HR

OPA4130UA/2K5

ACTIVE

SOIC

D

14

2500

Pb-Free

(RoHS)

CU NIPDAU

Level-3-260C-168 HR

OPA4130UA/2K5E4

ACTIVE

SOIC

D

14

2500

Pb-Free

(RoHS)

CU NIPDAU

Level-3-260C-168 HR

OPA4130UAE4

ACTIVE

SOIC

D

14

58

Pb-Free

(RoHS)

CU NIPDAU

Level-3-260C-168 HR

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and

package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS

compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame

retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

PACKAGE OPTION ADDENDUM

www.ti.com

12-Jan-2007

Addendum-Page 1