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CY62148E MoBL®
Document #: 38-05442 Rev. *F
Page 4 of 10
Thermal Resistance [10]
Parameter
Description
Test Conditions
SOIC
Package
TSOP II
Package
Unit
ΘJA
Thermal Resistance
(Junction to Ambient)
Still Air, soldered on a 3 × 4.5 inch,
two-layer printed circuit board
75
77
°C/W
ΘJC
Thermal Resistance
(Junction to Case)
10
13
°C/W
AC Test Loads and Waveforms
Parameters
5.0V
Unit
R1
1800
Ω
R2
990
Ω
RTH
639
Ω
VTH
1.77
V
Data Retention Characteristics (Over the Operating Range)
Parameter
Description
Conditions
Min
Typ [3]
Max Unit
VDR
VCC for Data Retention
2
V
ICCDR
Data Retention Current
VCC= VDR, CE > VCC – 0.2V,
VIN > VCC – 0.2V or VIN < 0.2V
Ind’l/Auto-A
1
7
µA
tCDR [10]
Chip Deselect to Data Retention Time
0
ns
tR [11]
Operation Recovery Time
tRC
ns
Data Retention Waveform
3.0V
VCC
OUTPUT
R2
30 pF
INCLUDING
JIG AND
SCOPE
GND
90%
10%
90%
10%
Rise Time = 1 V/ns
Fall Time = 1 V/ns
OUTPUT
V
Equivalent to:
THEVENIN
EQUIVALENT
ALL INPUT PULSES
RTH
R1
VCC(min)
VCC(min)
tCDR
VDR > 2.0V
DATA RETENTION MODE
tR
VCC
CE
Note
11. Full device operation requires linear VCC ramp from VDR to VCC(min) > 100 µs or stable at VCC(min) > 100 µs.
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