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CY62146EV30LL-45ZSXI Datasheet(PDF) 1 Page - Cypress Semiconductor |
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CY62146EV30LL-45ZSXI Datasheet(HTML) 1 Page - Cypress Semiconductor |
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1 / 12 page  CY62146EV30 MoBL® 4-Mbit (256 K × 16) Static RAM Cypress Semiconductor Corporation • 198 Champion Court • San Jose , CA 95134-1709 • 408-943-2600 Document Number: 38-05567 Rev. *H Revised April 10, 2013 4-Mbit (256 K × 16) Static RAM Features ■ Very high speed: 45 ns ■ Temperature ranges ❐ Industrial: –40 °C to +85 °C ❐ Automotive-A: –40 °C to +85 °C ■ Wide voltage range: 2.20 V to 3.60 V ■ Pin compatible with CY62146DV30 ■ Ultra low standby power ❐ Typical standby current: 1 A ❐ Maximum standby current: 7 A ■ Ultra low active power ❐ Typical active current: 2 mA at f = 1 MHz ■ Easy memory expansion with CE and OE features ■ Automatic power down when deselected ■ Complementary metal oxide semiconductor (CMOS) for optimum speed and power ■ Available in a Pb-free 48-ball very fine ball grid array (VFBGA) and 44-pin TSOP II Packages Functional Description The CY62146EV30 is a high performance CMOS static RAM organized as 256K words by 16 bits. This device features an advanced circuit design designed to provide an ultra low active current. Ultra low active current is ideal for providing More Battery Life (MoBL®) in portable applications such as cellular telephones. The device also has an automatic power down feature that significantly reduces power consumption by 80 percent when addresses are not toggling.The device can also be put into standby mode reducing power consumption by more than 99 percent when deselected (CE HIGH). The input and output pins (I/O0 through I/O15) are placed in a high impedance state when the device is deselected (CE HIGH), outputs are disabled (OE HIGH), both Byte High Enable and Byte Low Enable are disabled (BHE, BLE HIGH), or a write operation is in progress (CE LOW and WE LOW). To write to the device, take Chip Enable (CE) and Write Enable (WE) input LOW. If Byte Low Enable (BLE) is LOW, then data from I/O pins (I/O0 through I/O7) is written into the location specified on the address pins (A0 through A17). If Byte High Enable (BHE) is LOW, then data from the I/O pins (I/O8 through I/O15) is written into the location specified on the address pins (A0 through A17). To read from the device, take Chip Enable (CE) and Output Enable (OE) LOW while forcing the Write Enable (WE) HIGH. If Byte Low Enable (BLE) is LOW, then data from the memory location specified by the address pins appears on I/O0 to I/O7. If Byte High Enable (BHE) is LOW, then data from memory appears on I/O8 to I/O15. See the Truth Table on page 11 for a complete description of read and write modes. Logic Block Diagram 256K x 16 RAM Array I/O0–I/O7 A8 A7 A6 A5 A2 COLUMN DECODER DATA IN DRIVERS OE A4 A3 I/O8–I/O15 CE WE BHE A0 A1 A9 A10 BLE |
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