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CY62136EV30
MoBL®
Document #: 38-05569 Rev. *B
Page 4 of 12
Thermal Resistance[8]
Parameter
Description
Test Conditions
VFBGA
Package
TSOP II
Package
Unit
Θ
JA
Thermal Resistance
(Junction to Ambient)[8]
Still Air, soldered on a 3 × 4.5 inch, two-layer
printed circuit board
75
77
°C/W
Θ
JC
Thermal Resistance
(Junction to Case)[8]
10
13
°C/W
AC Test Loads and Waveforms
Parameters
2.50V
3.0V
Unit
R1
16667
1103
Ω
R2
15385
1554
Ω
RTH
8000
645
Ω
VTH
1.20
1.75
V
Data Retention Characteristics (Over the Operating Range)[8, 9]
Parameter
Description
Conditions
Min.
Typ.[4]
Max.
Unit
VDR
VCC for Data Retention
1.0
V
ICCDR
Data Retention Current
VCC= 1.0V
CE > VCC – 0.2V,
VIN > VCC – 0.2V or VIN < 0.2V
0.8
3
µA
tCDR
[8]
Chip Deselect to Data
Retention Time
0ns
tR
[9]
Operation Recovery
Time
tRC
ns
VCC
VCC
OUTPUT
R2
30 pF
INCLUDING
JIG AND
SCOPE
GND
90%
10%
90%
10%
Rise Time = 1 V/ns
Fall Time = 1 V/ns
OUTPUT
VTH
Equivalent to: THÉVENIN EQUIVALENT
ALL INPUT PULSES
RTH
R1
Data Retention Waveform
Notes:
9. Full device operation requires linear VCC ramp from VDR to VCC(min.) > 100 µs or stable at VCC(min.) > 100 µs.
VCC(min)
VCC(min)
tCDR
VDR > 1.0 V
DATA RETENTION MODE
tR
VCC
CE
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