February 15, 2007
Document No. 38-12018 Rev. *J
8
CY8C24094, CY8C24794, CY8C24894, and CY8C24994 Final Data Sheet
PSoC® Overview
Document Conventions
Acronyms Used
The following table lists the acronyms that are used in this doc-
ument.
Units of Measure
A units of measure table is located in the Electrical Specifica-
tions section. Table 3-1 on page 22 lists all the abbreviations
used to measure the PSoC devices.
Numeric Naming
Hexidecimal numbers are represented with all letters in upper-
case with an appended lowercase ‘h’ (for example, ‘14h’ or
‘3Ah’). Hexidecimal numbers may also be represented by a ‘0x’
prefix, the C coding convention. Binary numbers have an
appended lowercase ‘b’ (e.g., 01010100b’ or ‘01000011b’).
Numbers not indicated by an ‘h’ or ‘b’ are decimal.
Table of Contents
For an in depth discussion and more information on your PSoC
device, obtain the PSoC Mixed-Signal Array Technical Refer-
ence Manual. This document encompasses and is organized
into the following chapters and sections.
1.
Pin Information ........................................................................................ 9
1.1
56-Pin Part Pinout ......................................................................... 9
1.2
56-Pin Part Pinout (with XRES) .................................................. 10
1.3
68-Pin Part Pinout ........................................................................ 11
1.4
68-Pin Part Pinout (On-Chip Debug) ........................................... 12
1.5
100-Ball VFBGA Part Pinout ........................................................ 13
1.6
100-Ball VFBGA Part Pinout (On-Chip Debug) ........................... 15
1.7
100-Pin Part Pinout (On-Chip Debug) .......................................... 17
2.
Register Reference ................................................................................ 19
2.1
Register Conventions ................................................................... 19
2.1.1
Abbreviations Used ....................................................... 19
2.2
Register Mapping Tables ............................................................. 19
3.
Electrical Specifications ....................................................................... 22
3.1
Absolute Maximum Ratings ......................................................... 23
3.2
Operating Temperature ................................................................ 23
3.3
DC Electrical Characteristics ........................................................ 23
3.3.1
DC Chip-Level Specifications ........................................ 23
3.3.2
DC General Purpose IO Specifications ......................... 24
3.3.3
DC Full-Speed USB Specifications ............................... 24
3.3.4
DC Operational Amplifier Specifications ....................... 25
3.3.5
DC Low Power Comparator Specifications ................... 26
3.3.6
DC Analog Output Buffer Specifications ....................... 27
3.3.7
DC Analog Reference Specifications ............................ 28
3.3.8
DC Analog PSoC Block Specifications .......................... 29
3.3.9
DC POR and LVD Specifications .................................. 29
3.3.10
DC Programming Specifications ................................... 30
3.4
AC Electrical Characteristics ........................................................ 31
3.4.1
AC Chip-Level Specifications ........................................ 31
3.4.2
AC General Purpose IO Specifications ......................... 32
3.4.3
AC Full-Speed USB Specifications ............................... 32
3.4.4
AC Operational Amplifier Specifications ........................ 33
3.4.5
AC Low Power Comparator Specifications ................... 35
3.4.6
AC Digital Block Specifications ..................................... 35
3.4.7
AC External Clock Specifications .................................. 35
3.4.8
AC Analog Output Buffer Specifications ........................ 36
3.4.9
AC Programming Specifications .................................... 37
3.4.10
AC I2C Specifications .................................................... 38
4.
Packaging Information .......................................................................... 39
4.1
Packaging Dimensions ................................................................. 39
4.2
Thermal Impedance ..................................................................... 42
4.3
Solder Reflow Peak Temperature ................................................ 42
5.
Development Tool Selection ................................................................ 43
5.1
Software ....................................................................................... 43
5.1.1
PSoC Designer .............................................................. 43
5.1.2
PSoC Express ............................................................... 43
5.1.3
PSoC Programmer ........................................................ 43
5.1.4
CY3202-C iMAGEcraft C Compiler ............................... 43
5.2
Development Kits ......................................................................... 43
5.2.1
CY3215-DK Basic Development Kit .............................. 43
5.2.2
CY3210-ExpressDK Development Kit ........................... 44
5.3
Evaluation Tools ........................................................................... 44
5.3.1
CY3210-MiniProg1 ........................................................ 44
5.3.2
CY3210-PSoCEval1 ...................................................... 44
5.3.3
CY3214-PSoCEvalUSB ................................................ 44
5.4
Device Programmers ................................................................... 44
5.4.1
CY3216 Modular Programmer ...................................... 44
5.4.2
CY3207ISSP In-System Serial Programmer (ISSP) ..... 44
5.5
Accessories (Emulation and Programming) ................................. 45
5.6
3rd-Party Tools ............................................................................. 45
5.7
Build a PSoC Emulator into Your Board ...................................... 45
6.
Ordering Information ............................................................................ 46
6.1
Ordering Code Definitions ............................................................ 46
7.
Sales and Company Information ......................................................... 47
7.1
Revision History ........................................................................... 47
7.2
Copyrights and Code Protection .................................................. 48
Acronym
Description
AC
alternating current
ADC
analog-to-digital converter
API
application programming interface
CPU
central processing unit
CT
continuous time
DAC
digital-to-analog converter
DC
direct current
ECO
external crystal oscillator
EEPROM
electrically erasable programmable read-only memory
FSR
full scale range
GPIO
general purpose IO
GUI
graphical user interface
HBM
human body model
ICE
in-circuit emulator
ILO
internal low speed oscillator
IMO
internal main oscillator
IO
input/output
IPOR
imprecise power on reset
LSb
least-significant bit
LVD
low voltage detect
MSb
most-significant bit
PC
program counter
PLL
phase-locked loop
POR
power on reset
PPOR
precision power on reset
PSoC®
Programmable System-on-Chip™
PWM
pulse width modulator
SC
switched capacitor
SRAM
static random access memory
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