Electronic Components Datasheet Search
  English  ▼
ALLDATASHEET.COM

X  

CY7C1372D-200AXC Datasheet(PDF) 7 Page - Cypress Semiconductor

Part # CY7C1372D-200AXC
Description  18-Mbit (512K x 36/1M x 18) Pipelined SRAM with NoBL??Architecture
Download  28 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Manufacturer  CYPRESS [Cypress Semiconductor]
Direct Link  http://www.cypress.com
Logo CYPRESS - Cypress Semiconductor

CY7C1372D-200AXC Datasheet(HTML) 7 Page - Cypress Semiconductor

Back Button CY7C1372D-200AXC Datasheet HTML 3Page - Cypress Semiconductor CY7C1372D-200AXC Datasheet HTML 4Page - Cypress Semiconductor CY7C1372D-200AXC Datasheet HTML 5Page - Cypress Semiconductor CY7C1372D-200AXC Datasheet HTML 6Page - Cypress Semiconductor CY7C1372D-200AXC Datasheet HTML 7Page - Cypress Semiconductor CY7C1372D-200AXC Datasheet HTML 8Page - Cypress Semiconductor CY7C1372D-200AXC Datasheet HTML 9Page - Cypress Semiconductor CY7C1372D-200AXC Datasheet HTML 10Page - Cypress Semiconductor CY7C1372D-200AXC Datasheet HTML 11Page - Cypress Semiconductor Next Button
Zoom Inzoom in Zoom Outzoom out
 7 / 28 page
background image
CY7C1370D
CY7C1372D
Document #: 38-05555 Rev. *F
Page 7 of 28
Introduction
Functional Overview
The CY7C1370D and CY7C1372D are synchronous-pipelined
Burst NoBL SRAMs designed specifically to eliminate wait
states during Write/Read transitions. All synchronous inputs
pass through input registers controlled by the rising edge of
the clock. The clock signal is qualified with the Clock Enable
input signal (CEN). If CEN is HIGH, the clock signal is not
recognized and all internal states are maintained. All
synchronous operations are qualified with CEN. All data
outputs pass through output registers controlled by the rising
edge of the clock. Maximum access delay from the clock rise
(tCO) is 2.6 ns (250-MHz device).
Accesses can be initiated by asserting all three Chip Enables
(CE1, CE2, CE3) active at the rising edge of the clock. If Clock
Enable (CEN) is active LOW and ADV/LD is asserted LOW,
the address presented to the device will be latched. The
access can either be a read or write operation, depending on
the status of the Write Enable (WE). BWX can be used to
conduct byte write operations.
Write operations are qualified by the Write Enable (WE). All
writes are simplified with on-chip synchronous self-timed write
circuitry.
Three synchronous Chip Enables (CE1, CE2, CE3) and an
asynchronous Output Enable (OE) simplify depth expansion.
All operations (Reads, Writes, and Deselects) are pipelined.
ADV/LD should be driven LOW once the device has been
deselected in order to load a new address for the next
operation.
Single Read Accesses
A read access is initiated when the following conditions are
satisfied at clock rise: (1) CEN is asserted LOW, (2) CE1, CE2,
and CE3 are ALL asserted active, (3) the Write Enable input
signal WE is deasserted HIGH, and (4) ADV/LD is asserted
LOW. The address presented to the address inputs is latched
into the Address Register and presented to the memory core
and control logic. The control logic determines that a read
access is in progress and allows the requested data to
propagate to the input of the output register. At the rising edge
of the next clock the requested data is allowed to propagate
through the output register and onto the data bus within 2.6 ns
(250-MHz device) provided OE is active LOW. After the first
clock of the read access the output buffers are controlled by
OE and the internal control logic. OE must be driven LOW in
order for the device to drive out the requested data. During the
second clock, a subsequent operation (Read/Write/Deselect)
can be initiated. Deselecting the device is also pipelined.
Therefore, when the SRAM is deselected at clock rise by one
of the chip enable signals, its output will tri-state following the
next clock rise.
Burst Read Accesses
The CY7C1370D and CY7C1372D have an on-chip burst
counter that allows the user the ability to supply a single
address and conduct up to four Reads without reasserting the
address inputs. ADV/LD must be driven LOW in order to load
a new address into the SRAM, as described in the Single Read
Access section above. The sequence of the burst counter is
determined by the MODE input signal. A LOW input on MODE
selects a linear burst mode, a HIGH selects an interleaved
burst sequence. Both burst counters use A0 and A1 in the
burst sequence, and will wrap-around when incremented suffi-
ciently. A HIGH input on ADV/LD will increment the internal
burst counter regardless of the state of chip enables inputs or
WE. WE is latched at the beginning of a burst cycle. Therefore,
the type of access (Read or Write) is maintained throughout
the burst sequence.
Single Write Accesses
Write access are initiated when the following conditions are
satisfied at clock rise: (1) CEN is asserted LOW, (2) CE1, CE2,
and CE3 are ALL asserted active, and (3) the write signal WE
is asserted LOW. The address presented is loaded into the
Address Register. The write signals are latched into the
Control Logic block.
On the subsequent clock rise the data lines are automatically
tri-stated regardless of the state of the OE input signal. This
allows the external logic to present the data on DQ and DQP
(DQa,b,c,d/DQPa,b,c,d for CY7C1370D and DQa,b/DQPa,b for
CY7C1372D). In addition, the address for the subsequent
access (Read/Write/Deselect) is latched into the Address
Register (provided the appropriate control signals are
asserted).
On the next clock rise the data presented to DQ and DQP
(DQa,b,c,d/DQPa,b,c,d for CY7C1370D & DQa,b/DQPa,b for
CY7C1372D) (or a subset for byte write operations, see Write
Cycle Description table for details) inputs is latched into the
device and the write is complete.
The data written during the write operation is controlled by BW
(BWa,b,c,d for CY7C1370D and BWa,b for CY7C1372D)
signals. The CY7C1370D/CY7C1372D provides byte write
capability that is described in the Write Cycle Description table.
VDDQ
I/O Power
Supply
Power supply for the I/O circuitry.
VSS
Ground
Ground for the device. Should be connected to ground of the system.
NC
No connects. This pin is not connected to the die.
NC/(36M,72M,
144M, 288M,
576M, 1G)
These pins are not connected. They will be used for expansion to the 36M, 72M, 144M, 288M,
576M and 1G densities.
ZZ
Input-
Asynchronous
ZZ “sleep” Input. This active HIGH input places the device in a non-time critical “sleep” condition
with data integrity preserved. During normal operation, this pin can be connected to VSS or left
floating. ZZ pin has an internal pull-down.
Pin Definitions (continued)
Pin Name
I/O Type
Pin Description


Similar Part No. - CY7C1372D-200AXC

ManufacturerPart #DatasheetDescription
logo
Cypress Semiconductor
CY7C1372D-200AXC CYPRESS-CY7C1372D-200AXC Datasheet
344Kb / 30P
   18-Mbit (512K X 36/1M X 18) Pipelined SRAM with NoBL Architecture
CY7C1372D-200AXC CYPRESS-CY7C1372D-200AXC Datasheet
1Mb / 33P
   18-Mbit (512 K x 36/1 M x 18) Pipelined SRAM with NoBL Architecture
CY7C1372D-200AXC CYPRESS-CY7C1372D-200AXC Datasheet
968Kb / 31P
   18-Mbit (512 K 횞 36/1 M 횞 18) Pipelined SRAM with NoBL??Architecture
More results

Similar Description - CY7C1372D-200AXC

ManufacturerPart #DatasheetDescription
logo
Cypress Semiconductor
CY7C1370DV25 CYPRESS-CY7C1370DV25 Datasheet
421Kb / 30P
   18-Mbit (512K x 36/1M x 18) Pipelined SRAM with NoBL??Architecture
CY7C1370DV25 CYPRESS-CY7C1370DV25_06 Datasheet
553Kb / 27P
   18-Mbit (512K x 36/1M x 18) Pipelined SRAM with NoBL??Architecture
CY7C1370D CYPRESS-CY7C1370D Datasheet
344Kb / 30P
   18-Mbit (512K X 36/1M X 18) Pipelined SRAM with NoBL Architecture
CY7C1370CV25 CYPRESS-CY7C1370CV25 Datasheet
712Kb / 27P
   512K x 36/1M x 18 Pipelined SRAM with NoBL??Architecture
CY7C1370C CYPRESS-CY7C1370C Datasheet
704Kb / 27P
   512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture
CY7C1372BV25 CYPRESS-CY7C1372BV25 Datasheet
726Kb / 26P
   512K x 36/1M x 18 Pipelined SRAM with NoBL Architecture
CY7C1460AV33 CYPRESS-CY7C1460AV33 Datasheet
395Kb / 27P
   36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM with NoBL??Architecture
CY7C1460AV25 CYPRESS-CY7C1460AV25_06 Datasheet
511Kb / 27P
   36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM with NoBL??Architecture
CY7C1460AV33 CYPRESS-CY7C1460AV33_06 Datasheet
513Kb / 27P
   36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM with NoBL??Architecture
CY7C1460AV25 CYPRESS-CY7C1460AV25 Datasheet
396Kb / 27P
   36-Mbit (1M x 36/2M x 18/512K x 72) Pipelined SRAM with NoBL??Architecture
More results


Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28


Datasheet Download

Go To PDF Page


Link URL




Privacy Policy
ALLDATASHEET.COM
Does ALLDATASHEET help your business so far?  [ DONATE ] 

About Alldatasheet   |   Advertisement   |   Datasheet Upload   |   Contact us   |   Privacy Policy   |   Link Exchange   |   Manufacturer List
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com