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CY7C1373D-133BGC Datasheet(PDF) 7 Page - Cypress Semiconductor

Part # CY7C1373D-133BGC
Description  18-Mbit (512K x 36/1M x 18) Flow-Through SRAM with NoBL??Architecture
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Manufacturer  CYPRESS [Cypress Semiconductor]
Direct Link  http://www.cypress.com
Logo CYPRESS - Cypress Semiconductor

CY7C1373D-133BGC Datasheet(HTML) 7 Page - Cypress Semiconductor

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CY7C1371D
CY7C1373D
Document #: 38-05556 Rev. *F
Page 7 of 29
Pin Definitions
Name
IO
Description
A0, A1, A
Input-
Synchronous
Address Inputs used to select one of the address locations. Sampled at the rising edge of the
CLK. A[1:0] are fed to the two-bit burst counter.
BWA, BWB
BWC, BWD
Input-
Synchronous
Byte Write Inputs, Active LOW. Qualified with WE to conduct writes to the SRAM. Sampled on
the rising edge of CLK.
WE
Input-
Synchronous
Write Enable Input, Active LOW. Sampled on the rising edge of CLK if CEN is active LOW. This
signal must be asserted LOW to initiate a write sequence.
ADV/LD
Input-
Synchronous
Advance/Load Input. Used to advance the on-chip address counter or load a new address. When
HIGH (and CEN is asserted LOW) the internal burst counter is advanced. When LOW, a new
address can be loaded into the device for an access. After being deselected, ADV/LD must be
driven LOW to load a new address.
CLK
Input-
Clock
Clock Input. Used to capture all synchronous inputs to the device. CLK is qualified with CEN. CLK
is only recognized if CEN is active LOW.
CE1
Input-
Synchronous
Chip Enable 1 Input, Active LOW. Sampled on the rising edge of CLK. Used in conjunction with
CE2 and CE3 to select/deselect the device.
CE2
Input-
Synchronous
Chip Enable 2 Input, Active HIGH. Sampled on the rising edge of CLK. Used in conjunction with
CE1 and CE3 to select/deselect the device.
CE3
Input-
Synchronous
Chip Enable 3 Input, Active LOW. Sampled on the rising edge of CLK. Used in conjunction with
CE1 and CE2 to select/deselect the device.
OE
Input-
Asynchronous
Output Enable, asynchronous input, Active LOW. Combined with the synchronous logic block
inside the device to control the direction of the IO pins. When LOW, the IO pins are allowed to
behave as outputs. When deasserted HIGH, IO pins are tri-stated, and act as input data pins. OE
is masked during the data portion of a write sequence, during the first clock when emerging from
a deselected state, when the device has been deselected.
CEN
Input-
Synchronous
Clock Enable Input, Active LOW. When asserted LOW the Clock signal is recognized by the
SRAM. When deasserted HIGH the Clock signal is masked. While deasserting CEN does not
deselect the device, use CEN to extend the previous cycle when required.
ZZ
Input-
Asynchronous
ZZ “Sleep” Input. This active HIGH input places the device in a non-time critical “sleep” condition
with data integrity preserved. For normal operation, this pin has to be LOW or left floating. ZZ pin
has an internal pull down.
DQs
IO-
Synchronous
Bidirectional Data IO lines. As inputs, they feed into an on-chip data register that is triggered by
the rising edge of CLK. As outputs, they deliver the data contained in the memory location specified
by the addresses presented during the previous clock rise of the read cycle. The direction of the
pins is controlled by OE. When OE is asserted LOW, the pins behave as outputs. When HIGH,
DQs and DQP[A:D] are placed in a tri-state condition.The outputs are automatically tri-stated during
the data portion of a write sequence, during the first clock when emerging from a deselected state,
and when the device is deselected, regardless of the state of OE.
DQPX
IO-
Synchronous
Bidirectional Data Parity IO Lines. Functionally, these signals are identical to DQs.
MODE
Input Strap Pin Mode Input. Selects the burst order of the device.
When tied to Gnd selects linear burst sequence. When tied to VDD or left floating selects interleaved
burst sequence.
VDD
Power Supply Power supply inputs to the core of the device.
VDDQ
IO Power
Supply
Power supply for the IO circuitry.
VSS
Ground
Ground for the device.


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