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CY7C1345G
Document Number: 38-05517 Rev. *E
Page 11 of 20
Capacitance
Tested initially and after any design or process change that may affect these parameters.
Parameter
Description
Test Conditions
100 TQFP
Max
119 BGA
Max
Unit
CIN
Input Capacitance
TA = 25°C, f = 1 MHz,
VDD = 3.3V.
VDDQ = 3.3V
55
pF
CCLK
Clock Input Capacitance
5
5
pF
CIO
Input or Output Capacitance
5
7
pF
Thermal Resistance
Tested initially and after any design or process change that may affect these parameters.
Parameter
Description
Test Conditions
100 TQFP
Package
119 BGA
Package
Unit
ΘJA
Thermal Resistance
(Junction to Ambient)
Test conditions follow
standard test methods and
procedures for measuring
thermal impedance, per
EIA/JESD51.
30.32
34.1
°C/W
ΘJC
Thermal Resistance
(Junction to Case)
6.85
14.0
°C/W
AC Test Loads and Waveforms
OUTPUT
R = 317
Ω
R = 351
Ω
5pF
INCLUDING
JIG AND
SCOPE
(a)
(b)
OUTPUT
RL = 50Ω
Z0 = 50Ω
VT= 1.5V
3.3V
ALL INPUT PULSES
VDDQ
GND
90%
10%
90%
10%
≤ 1ns
≤ 1ns
(c)
OUTPUT
R = 1667
Ω
R = 1538
Ω
5pF
INCLUDING
JIG AND
SCOPE
(a)
(b)
OUTPUT
RL = 50Ω
Z0 = 50Ω
VT = 1.25V
2.5V
ALL INPUT PULSES
VDDQ
GND
90%
10%
90%
10%
≤ 1 ns
≤ 1 ns
(c)
3.3V I/O Test Load
2.5V I/O Test Load
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