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CY7C1346H
Document #: 38-05672 Rev. *B
Page 9 of 16
Capacitance[10]
Parameter
Description
Test Conditions
100 TQFP
Max.
Unit
CIN
Input Capacitance
TA = 25°C, f = 1 MHz,
VDD = 3.3V.
VDDQ = 2.5V
5
pF
CCLK
Clock Input Capacitance
5
pF
CI/O
Input/Output Capacitance
5
pF
Thermal Resistance[10]
Parameter
Description
Test Conditions
100 TQFP
Package
Unit
Θ
JA
Thermal Resistance
(Junction to Ambient)
Test conditions follow standard test
methods and procedures for measuring
thermal impedance, per EIA/JESD51
30.32
°C/W
Θ
JC
Thermal Resistance
(Junction to Case)
6.85
°C/W
AC Test Loads and Waveforms
Note:
10. Tested initially and after any design or process change that may affect these parameters.
OUTPUT
R = 317
Ω
R = 351
Ω
5pF
INCLUDING
JIG AND
SCOPE
(a)
(b)
OUTPUT
RL = 50Ω
Z0 = 50Ω
VL = 1.5V
3.3V
ALL INPUT PULSES
VDDQ
GND
90%
10%
90%
10%
≤ 1 ns
≤ 1 ns
(c)
3.3V I/O Test Load
OUTPUT
R = 1667
Ω
R =1538
Ω
5pF
INCLUDING
JIG AND
SCOPE
(a)
(b)
OUTPUT
RL = 50Ω
Z0 = 50Ω
VT = 1.25V
2.5V
ALL INPUT PULSES
VDDQ
GND
90%
10%
90%
10%
≤ 1 ns
≤ 1 ns
(c)
2.5V I/O Test Load
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