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CY7C1061BV33-10ZXC Datasheet(PDF) 1 Page - Cypress Semiconductor

Part # CY7C1061BV33-10ZXC
Description  16-Mbit (1M x 16) Static RAM
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Manufacturer  CYPRESS [Cypress Semiconductor]
Direct Link  http://www.cypress.com
Logo CYPRESS - Cypress Semiconductor

CY7C1061BV33-10ZXC Datasheet(HTML) 1 Page - Cypress Semiconductor

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16-Mbit (1M x 16) Static RAM
CY7C1061BV33
Cypress Semiconductor Corporation
198 Champion Court
San Jose
, CA 95134-1709
408-943-2600
Document #: 38-05693 Rev. *B
Revised August 3, 2006
Features
•High speed
—tAA = 10 ns
• Low active power
— 990 mW (max.)
• Operating voltages of 3.3 ± 0.3V
• 2.0V data retention
• Automatic power-down when deselected
• TTL-compatible inputs and outputs
• Available in Pb-free and non Pb-free 54-pin TSOP II
package
Functional Description
The CY7C1061BV33 is a high-performance CMOS Static
RAM organized as 1,048,576 words by 16 bits.
Writing to the device is accomplished by enabling the chip (CE
LOW) while forcing the Write Enable (WE) input LOW. If Byte
Low Enable (BLE) is LOW, then data from I/O pins (I/O0
through I/O7), is written into the location specified on the
address pins (A0 through A19). If Byte High Enable (BHE) is
LOW, then data from I/O pins (I/O8 through I/O15) is written into
the location specified on the address pins (A0 through A19).
Reading from the device is accomplished by enabling the chip
by taking CE LOW while forcing the Output Enable (OE) LOW
and the Write Enable (WE) HIGH. If Byte Low Enable (BLE) is
LOW, then data from the memory location specified by the
address pins will appear on I/O0 to I/O7. If Byte High Enable
(BHE) is LOW, then data from memory will appear on I/O8 to
I/O15. See the truth table at the back of this data sheet for a
complete description of Read and Write modes.
The input/output pins (I/O0 through I/O15) are placed in a
high-impedance state when the device is deselected (CE
HIGH), the outputs are disabled (OE HIGH), the BHE and BLE
are disabled (BHE, BLE HIGH), or during a Write operation
(CE LOW and WE LOW).
The CY7C1061BV33 is available in a 54-pin TSOP II package
with center power and ground (revolutionary) pinout.
Logic Block Diagram
A1
A2
A3
A4
A5
A6
A7
A8
COLUMN
DECODER
INPUT BUFFER
1M x 16
ARRAY
A0
I/O0–I/O7
OE
I/O8–I/O15
CE
WE
BLE
BHE
A9
WE
1
2
3
4
5
6
7
8
9
10
11
14
31
32
36
35
34
33
37
40
39
38
12
13
41
43
42
16
15
29
30
A5
A6
A7
A8
A0
A1
OE
VSS
A17
I/O15
A2
CE
I/O2
I/O0
I/O1
BHE
A3
A4
18
17
20
19
I/O3 27
28
25
26
22
21
23
24
I/O6
I/O4
I/O5
I/O7
A16
A15
BLE
VCC
I/O14
I/O13
I/O12
I/O10
I/O9
I/O8
A14
A13
A12
A11
A9
A10
44
46
45
47
50
49
48
51
53
52
54
VSS
VCC
A19
A18
VCC
VCC
VSS
VSS
NC
VCC
I/O11
VSS
DNU/VCC
DNU/VSS
54-pin TSOP II (Top View)
Notes:
1. DNU/VCC Pin (#16) has to be left floating or connected to VCC and DNU/VSS Pin (#40) has to be left floating or connected to VSS to ensure proper application.
2. NC – No Connect Pins are not connected to the die
Pin Configurations[1, 2]
[+] Feedback
[+] Feedback


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