CY7C1011CV33
Document #: 38-05232 Rev. *E
Page 3 of 11
Maximum Ratings
(Above which the useful life may be impaired. For user guide-
lines, not tested.)
Storage Temperature ................................. –65
°C to +150°C
Ambient Temperature with
Power Applied............................................. –55
°C to +125°C
Supply Voltage on VCC to Relative GND
[1] .... –0.5V to +4.6V
DC Voltage Applied to Outputs
in High-Z State[1] ....................................–0.5V to VCC + 0.5V
DC Input Voltage[1].................................–0.5V to VCC + 0.5V
Current into Outputs (LOW)......................................... 20 mA
Static Discharge Voltage............................................ >2001V
(per MIL-STD-883, Method 3015)
Latch-up Current...................................................... >200 mA
Operating Range
Range
Ambient
Temperature
VCC
Commercial
0
°C to +70°C
3.3V
± 0.3V
Industrial
–40
°C to +85°C
DC Electrical Characteristics Over the Operating Range
Parameter
Description
Test Conditions
–10
–12
–15
Unit
Min.
Max.
Min.
Max.
Min.
Max.
VOH
Output HIGH Voltage
VCC = Min., IOH = –4.0 mA
2.4
2.4
2.4
V
VOL
Output LOW Voltage
VCC = Min., IOL = 8.0 mA
0.4
0.4
0.4
V
VIH
Input HIGH Voltage
2.0
VCC
+ 0.3
2.0
VCC
+ 0.3
2.0
VCC
+ 0.3
V
VIL
Input LOW Voltage[1]
–0.30.8
–0.3
0.8–0.30.8
V
IIX
Input Leakage Current
GND < VI < VCC
–1
+1
–1
+1
–1
+1
µA
IOZ
Output Leakage Current GND < VOUT < VCC,
Output Disabled
–1
+1
–1
+1
–1
+1
µA
ICC
VCC Operating
Supply Current
VCC = Max.,
f = fMAX = 1/tRC
Com’l
908580
mA
Ind’l
100
95
90
mA
ISB1
Automatic CE
Power-down Current
—TTL Inputs
Max. VCC, CE > VIH
VIN > VIH or
VIN < VIL, f = fMAX
40
40
40
mA
ISB2
Automatic CE
Power-down Current
—CMOS Inputs
Max. VCC,
CE > VCC – 0.3V,
VIN > VCC – 0.3V,
or VIN < 0.3V, f = 0
Com’l/
Ind’l
10
10
10
mA
Capacitance[2]
Parameter
Description
Test Conditions
Max.
Unit
CIN
Input Capacitance
TA = 25°C, f = 1 MHz, VCC = 3.3V
8
pF
COUT
I/O Capacitance
8
pF
Thermal Resistance[2]
Parameter
Description
Test Conditions
TSOP II
TQFP
VFBGA
Unit
Θ
JA
Thermal Resistance
(Junction to Ambient)
Still Air, soldered on a 3 × 4.5 inch,
four-layer printed circuit board
44.56
42.66
46.98
°C/W
Θ
JC
Thermal Resistance
(Junction to Case)
10.75
14.64
9.63
°C/W
Notes:
1. VIL (min.) = –2.0V for pulse durations of less than 20 ns.
2. Tested initially and after any design or process changes that may affect these parameters.
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