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TZA3001U Datasheet(PDF) 2 Page - NXP Semiconductors |
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TZA3001U Datasheet(HTML) 2 Page - NXP Semiconductors |
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2 / 22 page  1999 Aug 24 2 Philips Semiconductors Preliminary specification SDH/SONET STM4/OC12 laser drivers TZA3001AHL; TZA3001BHL; TZA3001U FEATURES • 622 Mbits/s data input, both Current-Mode Logic (CML) and Positive Emitter Coupled Logic (PECL) compatible; maximum 800 mV (p-p) • Adaptive laser output control with dual loop, stabilizing optical ONE and ZERO levels • Optional external control of laser modulation and biasing currents (non-adaptive) • Automatic laser shutdown • Few external components required • Rise and fall times of 120 ps (typical value) • Jitter <50 mUI (p-p) • RF output current sinking capability of 60 mA • Bias current sinking capability of 90 mA • Power dissipation of 430 mW (typical value) • Low cost LQFP32 plastic package • Single 5 V power supply. TZA3001AHL • Laser alarm output for signalling extremely low and high bias current conditions. TZA3001BHL • Extra STM4 622 Mbits/s loop mode input; both CML and PECL compatible. TZA3001U • Bare die version with combined bias alarm and loop mode functionality. APPLICATIONS • SDH/SONET STM4/OC12 optical transmission systems • SDH/SONET STM4/OC12 optical laser modules. GENERAL DESCRIPTION The TZA3001AHL, TZA3001BHL and TZA3001U are fully integrated laser drivers for STM4/OC12 (622 Mbits/s) systems, incorporating the RF path between the data multiplexer and the laser diode. Since the dual loop bias and modulation control circuits are integrated on the IC, the external component count is low. Only decoupling capacitors and adjustment resistors are required. The TZA3001AHL features an alarm function for signalling extreme bias current conditions. The alarm low and high threshold levels can be adjusted to suit the application using only a resistor or a current Digital-to-Analog Converter (DAC). The TZA3001BHL is provided with an additional RF data input to facilitate remote (loop mode) system testing. The TZA3001U is a bare die version for use in compact laser module designs. The die contains 40 pads and features the combined functionality of the TZA3001AHL and the TZA3001BHL. ORDERING INFORMATION TYPE NUMBER PACKAGE NAME DESCRIPTION VERSION TZA3001AHL LQFP32 plastic low profile quad flat package; 32 leads; body 5 × 5 × 1.4 mm SOT401-1 TZA3001BHL TZA3001U − bare die; 2000 × 2000 × 380 µm − |
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Similar Description - TZA3001U |
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