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SSC-MPW104-F1 Datasheet(PDF) 5 Page - Seoul Semiconductor |
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SSC-MPW104-F1 Datasheet(HTML) 5 Page - Seoul Semiconductor |
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5 / 11 page  5. Soldering profile Reflow Soldering Conditions/ Profile (1) Lead Solder -Preliminary heating to be at 150℃max. for 2 minutes max. -Soldering heat to be at 240℃max. for 5 seconds max. Temperature rise: 5°C/sec. -5°C/sec. Cooling: Pre-heating Operation heating 60 to 120 sec. 5sec. max 120 150 240 °C 0 (2) Lead-Free Solder -Preliminary heating to be at 150℃max. for 2 minutes max. -Soldering heat to be at 260℃max. for 10 seconds max. 120 60 to 120 sec. 0 260 150 °C Pre-heating rise: 5°C/sec. Temperature Operation heating -5°C/sec. Cooling: 5to10 sec. (3) Hand Solder SEOUL SEMICONDUCTOR CO,. LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, Korea TEL: 82-2-3281-6269 FAX: 82-2-858-5537 - 5/11 - SSC-MPW104-F1 SSC-QP-0401-06(REV.0) -Not more than 3 seconds @MAX280℃, under Soldering iron. |
Similar Part No. - SSC-MPW104-F1 |
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Similar Description - SSC-MPW104-F1 |
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