PS2761-1

NOTES ON HANDLING

1. Recommended soldering conditions

(1) Infrared reflow soldering

• Peak reflow temperature

235

°C or below (package surface temperature)

• Time of temperature higher than 210

°C

30 seconds or less

• Number of reflows

Three

• Flux

Rosin flux containing small amount of chlorine (The flux with a

maximum chlorine content of 0.2 Wt % is recommended.)

60 to 120 s

(preheating)

210 ˚C

100 to 160 ˚C

Time (s)

(heating)

to 10 s

to 30 s

235 ˚C (peak temperature)

Recommended Temperature Profile of Infrared Reflow

(2) Dip soldering

• Temperature

260

°C or below (molten solder temperature)

• Time

10 seconds or less

• Number of times

One (Allowed to be dipped in solder including plastic mold portion.)

• Flux

Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of

0.2 Wt % is recommended.)

(3) Cautions

• Fluxes

Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.

2. Cautions regarding noise

Be aware that when voltage is applied suddenly between the photocoupler’s input and output or between

corrector-emitters at startup, the output side may enter the on state, even if the voltage is within the absolute

maximum ratings.

Data Sheet PN10249EJ01V0DS

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