MOC3009 THRU MOC3012

OPTOCOUPLERS/OPTOISOLATORS

SOES024A – AUGUST 1985 – REVISED APRIL 1998

6

POST OFFICE BOX 655303

MECHANICAL INFORMATION

Each device consists of a gallium-arsenide infrared-emitting diode optically coupled to a silicon phototriac mounted

on a 6-terminal lead frame encapsulated within an electrically nonconductive plastic compound. The case can

withstand soldering temperature with no deformation and device performance characteristics remain stable when

operated in high-humidity conditions.

C

0,534 (0.021)

0,381 (0.015)

6 Places

Seating Plane

C

L

L

7,62 (0.300) T.P.

(see Note A)

6,61 (0.260)

6,09 (0.240)

0,305 (0.012)

0,203 (0.008)

3,81 (0.150)

3,17 (0.125)

5,46 (0.215)

2,95 (0.116)

1,78 (0.070)

0,51 (0.020)

2,29 (0.090)

1,27 (0.050)

4 Places

2,54 (0.100) T.P.

(see Note A)

1,01 (0.040) MIN

1,78 (0.070) MAX

6 Places

9,40 (0.370)

8,38 (0.330)

Index Dot

(see Note B)

105

°

90

°

1

2

3

6

5

4

NOTES: A. Leads are within 0,13 mm (0.005 inch) radius of true position (T.P.) with maximum material condition and unit installed.

B. Pin 1 identified by index dot.

C. The dimensions given fall within JEDEC MO-001 AM dimensions.

D. All linear dimensions are given in millimeters and parenthetically given in inches.

Figure 11. Packaging Specifications