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AM29243EH Datasheet(PDF) 23 Page - Advanced Micro Devices

Part # AM29243EH
Description  Enhanced High-Performance RISC Microcontrollers
Download  36 Pages
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Manufacturer  AMD [Advanced Micro Devices]
Direct Link  http://www.amd.com
Logo AMD - Advanced Micro Devices

AM29243EH Datasheet(HTML) 23 Page - Advanced Micro Devices

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P R E L I M I N A R Y
23
Am29240 EH Microcontroller Series
SWITCHING CHARACTERISTICS over COMMERCIAL Operating Ranges (continued)
Preliminary
25 MHz
20 MHz
16 MHz
No.
Unit
Max
Min
Max
Min
Max
Min
Test Conditions 1
Parameter Description
17
Asynchronous Input Pulse Width
LSYNC and PSYNC
Note 5
Note 5
Note 5
All others
4T
4T
4T
ns
18
UCLK Period
Note 2
30
25
20
ns
VCLK Period
Note 2
25
20
15
ns
19
UCLK High Time
Note 2
10
8
6
ns
VCLK High Time
Note 2
8
6
4
ns
20
UCLK Low Time
Note 2
10
8
6
ns
VCLK Low Time
Note 2
8
6
4
ns
21
UCLK Rise time
Note 2
0
5
0
5
0
5
ns
VCLK Rise time
Note 2
0
3
0
3
0
3
ns
22
UCLK Fall Time
Note 2
0
5
0
5
0
5
ns
VCLK Fall Time
Note 2
0
3
0
3
0
3
ns
23
Synchronous Output Valid Delay
from VCLK Rise and Fall
Note 6
1
16
1
14
1
14
ns
24
Input Setup Time to VCLK Rise
and Fall
Notes 6, 7
10
9
9
ns
25
Input Hold Time to VCLK Rise
and Fall
Notes 6, 7
0
0
0
ns
26
RAS Low Time
50
50
50
ns
27
CAS Low Time
13
13
13
ns
Notes:
1. All outputs driving 80 pF, measured at VOL = 1.5 V and VOH = 1.5 V using the switching test circuit shown on page 33.
For higher capacitance loads:
A. Add 1 ns output delay per 15 pF loading above 80 pF, up to 150 pF total. The minimum delay from PIAOE to PIACSx is 0 ns if
the capacitance loading on PIACSx is equal to or higher than the capacitance loading on PIAOE.
B. Add 1 ns output delay per 25 pF loading above 80 pF, up to 300 pF total. For 2/1 DRAM timing, in order to meet the setup time
(tASR) from A23–A0 to RAS3–RAS0 for DRAM, the capacitive loading of A23–A0 must not exceed the capacitance loading of
RAS3–RAS0 by more than 150 pF.
C. Add 1 ns of output delay for MEMCLK to drive an external load of 100 pF.
2. VCLK and UCLK can be driven with TTL inputs. UCLK must be tied High if it is unused.
3. Maximum INCLK-to-MEMCLK delay can be decreased by 0.5 ns for each 10 mA increase in IOL up to the maximum of 20 mA,
i.e., 6 ns maximum delay at IOL = 20 mA.
4. ID31–ID0 and IDP3–IDP0 are sampled on the rising edge of MEMCLK for all non-DRAM accesses, simple DRAM accesses,
and the first access of a DRAM page-mode access. ID31–ID0 and IDP3–IDP0 are sampled on the rising edge of CASx for all
DRAM page-mode accesses, except the first access of a DRAM page-mode access. (See Figures 1–12 on pages 25–32.)
A. Applies to ID31–ID0 and IDP3–IDP0 for simple DRAM accesses and the first access of a DRAM page-mode access.
B. Applies to ID31–ID0 and IDP3–IDP0 for DRAM page-mode accesses, except the first access of a DRAM page-mode access.
When ID31–ID0 and IDP3–IDP0 are sampled on CASx, there is no additional setup time required for ID31–ID0 and
IDP3–IDP0 when the parity is enabled.
5. LSYNC and PSYNC minimum width is two bit-times. A bit-time is one period of the internal video clock, which is determined by
the CLKDIV field in the Video Control Register and VCLK.
6. Active VCLK edge depends on the CLKI bit in the Video Control Register.
7. LSYNC and PSYNC can be treated as synchronous signals by meeting the setup and hold times, though the synchronization
delay still applies.


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