Philips Semiconductors

TDA8941P

1.5 W mono BTL audio amplifier

Product specification

Rev. 02 — 7 April 2000

17 of 21

9397 750 06864

© Philips Electronics N.V. 2000. All rights reserved.

17. Soldering

17.1 Introduction to soldering through-hole mount packages

This text gives a brief insight to wave, dip and manual soldering. A more in-depth

account of soldering ICs can be found in our

Data Handbook IC26; Integrated Circuit

Packages (document order number 9398 652 90011).

Wave soldering is the preferred method for mounting of through-hole mount IC

packages on a printed-circuit board.

17.2 Soldering by dipping or by solder wave

The maximum permissible temperature of the solder is 260

°C; solder at this

temperature must not be in contact with the joints for more than 5 seconds. The total

contact time of successive solder waves must not exceed 5 seconds.

The device may be mounted up to the seating plane, but the temperature of the

If the printed-circuit board has been pre-heated, forced cooling may be necessary

immediately after soldering to keep the temperature within the permissible limit.

17.3 Manual soldering

Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the

seating plane or not more than 2 mm above it. If the temperature of the soldering iron

bit is less than 300

°C it may remain in contact for up to 10 seconds. If the bit

temperature is between 300 and 400

°C, contact may be up to 5 seconds.

17.4 Package related soldering information

[1]

For SDIP packages, the longitudinal axis must be parallel to the transport direction of the

printed-circuit board.

Table 10: Suitability of through-hole mount IC packages for dipping and wave soldering

methods

Package

Soldering method

Dipping

Wave

DBS, DIP, HDIP, SDIP, SIL

suitable