U630H16XS

11

March 31, 2006

STK Control #ML0039

Rev 1.0

Test Configuration for Functional Check

t:

Conditions

Symbol

Min.

Max.

Unit

Input Capacitance

f

= 5.0 V

= 1 MHz

= 25

°C

8pF

Output Capacitance

7pF

All pads not under test must be connected with ground by capacitors.

255

DQ0

DQ1

DQ2

DQ3

DQ4

DQ5

DQ6

DQ7

A0

A1

A2

A3

A4

A5

A6

A7

A8

A9

A10

E

W

G

5 V

NE

480

XS

25

C

U630H16

Type

bare die

Ordering Code

Example

Operating Temperature Range

C=

0 to 70 °C

K= -40 to 85 °C

Access Time

25 = 25 ns

35 = 35 ns

45 = 45 ns

Bonding Instructions

The U630H16XS has 30 relevant bond pads and 4 additional pads.

The 4 additional pads must not be bonded.

Refer to the bond pad location and identification table for a complete list of bond pads and coordinates.

It is mandatory to use a bond wire on each VCC and two bond wires on VSS bond pad for noise immunity.

The backside of the die is connected to VCC and can be contacted with the substrate in case of the same potential.

The pad VBND has to be connected with VCC in order to enable the HardStore mode of the chip.