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TSC2004 Datasheet(PDF) 2 Page - Burr-Brown (TI) |
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TSC2004 Datasheet(HTML) 2 Page - Burr-Brown (TI) |
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2 / 54 page  www.ti.com ABSOLUTE MAXIMUM RATINGS (1) TSC2004 SBAS408A – JUNE 2007 – REVISED AUGUST 2007 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION(1) TYPICAL TYPICAL NO MISSING INTEGRAL GAIN CODES SPECIFIED TRANSPORT LINEARITY ERROR RESOLUTION PACKAGE PACKAGE TEMPERATURE PACKAGE ORDERING MEDIA, PRODUCT (LSB) (LSB) (BITS) TYPE DESIGNATOR RANGE MARKING NUMBER QUANTITY Small Tape TSC2004IRTJT 20-Pin, and Reel, 250 0.8 x 4 x 4 RTJ –40 °C to +85°C TSC2004I Tape and Thin QFN TSC2004IRTJR Reel, 2500 TSC2004 –0.8 to +1.4 +0.1 11 Small Tape 18-Pin, TSC2004IYZKT and Reel, 250 5 x 5 Matrix, YZK –40 °C to +85°C TSC2004I 2.5 x 2.5 Tape and TSC2004IYZKR WCSP Reel, 2500 (1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet, or see the TI website at www.ti.com. Over operating free-air temperature range (unless otherwise noted) TSC2004 UNIT Analog input X+, Y+, AUX to SNSGND –0.4 to SNSVDD + 0.1 V Analog input X–, Y– to SNSGND –0.4 to SNSVDD + 0.1 V SNSVDD to SNSGND –0.3 to 5 V Voltage range SNSVDD to AGND –0.3 to 5 V I/OVDD to DGND –0.3 to 5 V SNSVDD to I/OVDD –2.40 to +0.3 V Digital input voltage to DGND –0.3 to I/OVDD + 0.3 V Digital output voltage to DGND –0.3 to I/OVDD + 0.3 V Power dissipation (TJ Max - TA)/θJA Low-K 113 °C/W WCSP package Thermal impedance, θJA High-K 62 °C/W QFN package 39.97 °C/W Operating free-air temperature range, TA –40 to +85 °C Storage temperature range, TSTG –65 to +150 °C Junction temperature, TJ Max +150 °C Vapor phase (60 sec) +215 °C Lead temperature Infrared (15 sec) +220 °C IEC contact discharge(2) X+, X–, Y+, Y– ±12 kV IEC air discharge(2) X+, X–, Y+, Y– ±25 kV (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to absolute-maximum rated conditions for extended periods may affect device reliability. (2) Test method based on IEC standard 61000-4-2. Contact Texas Instruments for test details. 2 Submit Documentation Feedback |
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