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TC1313 Datasheet(PDF) 4 Page - Microchip Technology

Part No. TC1313
Description  500 mA Synchronous Buck Regulator, 300 mA LDO
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

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TC1313
DS21974A-page 4
© 2005 Microchip Technology Inc.
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
VIN - AGND ......................................................................6.0V
All Other I/O .............................. (AGND - 0.3V) to (VIN + 0.3V)
LX to PGND.............................................. -0.3V to (VIN + 0.3V)
PGND to AGND...................................................-0.3V to +0.3V
Output Short Circuit Current ................................. Continuous
Power Dissipation (Note 7) ..........................Internally Limited
Storage temperature .....................................-65°C to +150°C
Ambient Temp. with Power Applied.................-40°C to +85°C
Operating Junction Temperature...................-40°C to +125°C
ESD protection on all pins (HBM)
....................................... 3kV
† Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied.
Exposure to maximum rating conditions for extended periods
may affect device reliability.
DC CHARACTERISTICS
Electrical Characteristics: VIN1 = VIN2 = SHDN1,2 =3.6V, COUT1 =CIN = 4.7 µF, COUT2 =1µF, L =4.7 µH, VOUT1 (ADJ) = 1.8V,
IOUT1 = 100 ma, IOUT2 = 0.1 mA TA = +25°C. Boldface specifications apply over the TA range of -40°C to +85°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Input/Output Characteristics
Input Voltage
VIN
2.7
5.5
V
Note 1, Note 2, Note 8
Maximum Output Current
IOUT1_MAX
500
——
mA
Note 1
Maximum Output Current
IOUT2_MAX
300
——
mA
Note 1
Shutdown Current
Combined VIN1 and VIN2 Current
IIN_SHDN
0.05
1
µA
SHDN1 = SHDN2= GND
Operating IQ
IQ
—57
100
µA
SHDN1 = SHDN2= VIN2
IOUT1 =0 mA, IOUT2 =0 mA
Synchronous Buck IQ
38
µA
SHDN1 = VIN, SHDN2 = GND
LDO IQ
44
µA
SHDN1 = GND, SHDN2 = VIN2
Shutdown/UVLO/Thermal Shutdown Characteristics
SHDN1,SHDN2,
Logic Input Voltage Low
VIL
——
15
%VIN
VIN1 =VIN2 = 2.7V to 5.5V
SHDN1,SHDN2,
Logic Input Voltage High
VIH
45
——
%VIN
VIN1 =VIN2 = 2.7V to 5.5V
SHDN1,SHDN2,
Input Leakage Current
IIN
-1.0
±0.01
1.0
µA
VIN1 =VIN2 = 2.7V to 5.5V
SHDNX =GND
SHDNY =VIN
Thermal Shutdown
TSHD
165
°C
Note 6, Note 7
Thermal Shutdown Hysteresis
TSHD-HYS
—10
°C
Undervoltage Lockout
(VOUT1 and VOUT2)
UVLO
2.4
2.55
2.7
VVIN1 Falling
Undervoltage Lockout Hysteresis
UVLO
-HYS
200
mV
Note
1:
The Minimum VIN has to meet two conditions: VIN ≥ 2.7V and VIN ≥ VRX + VDROPOUT, VRX = VR1 or VR2.
2:
VRX is the regulator output voltage setting.
3:
TCVOUT2 = ((VOUT2max – VOUT2min) * 10
6)/(V
OUT2 * DT).
4:
Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested
over a load range from 0.1 mA to the maximum specified output current.
5:
Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its
nominal value measured at a 1V differential.
6:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air. (i.e. TA, TJ, θJA). Exceeding the maximum allowable power
dissipation causes the device to initiate thermal shutdown.
7:
The integrated MOSFET switches have an integral diode from the LX pin to VIN, and from LX to PGND. In cases where
these diodes are forward-biased, the package power dissipation limits must be adhered to. Thermal protection is not
able to limit the junction temperature for these cases.
8:
VIN1 and VIN2 are supplied by the same input source.


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