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SY89473U Datasheet(PDF) 4 Page - Micrel Semiconductor |
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SY89473U Datasheet(HTML) 4 Page - Micrel Semiconductor |
4 / 11 page Micrel, Inc. SY89473U May 2007 4 M9999-052207-B hbwhelp@micrel.com or (408) 955-1690 Absolute Maximum Ratings (1) Supply Voltage (VCC)....................................-0.5V to +4.0V Input Voltage (VIN)........................................... -0.5V to VCC LVPECL Output Current (IOUT) Continuous ...........................................................±50mA Surge ..................................................................±100mA Input Current Source/sink Current on IN, /IN..............................±50mA Source/sink Current on VT ..................................±100mA VREF-AC Current Source/sink Current on VREF-AC...............................±2mA Lead Temperature (soldering, 20 sec.) ...................+260°C Storage Temperature (TS) ...........................-65°C to 150°C Operating Ratings (2) Supply Voltage (VCC) .................................. +2.375V to +2.625V ....................................................................+3.0V to +3.6V Ambient Temperature (TA).................................–40°C to +85°C Package Thermal Resistance (3) MLF ® (θJA) Still-Air.................................................................... 50°C/W MLF ® (ΨJB) Junction-to-Board ................................................... 30°C/W DC Electrical Characteristics (4) TA = –40°C to +85°C; unless otherwise stated. Symbol Parameter Condition Min Typ Max Units 2.375 2.5 2.625 V VCC Power Supply 3.0 3.3 3.6 V ICC Power Supply Current No load, max VCC. 45 65 mA RIN Input Resistance (IN-to-VT) 45 50 55 Ω RDIFF_IN Differential Input Resistance (IN-to-/IN) 90 100 110 Ω VIH Input High Voltage (IN, /IN) 1.2 VCC V VIL Input Low Voltage (IN, /IN) 0 VIH-0.1 V VIN Input Voltage Swing (IN, /IN) See Figure 1a. Note 5 0.1 VCC V VDIFF_IN Differential Input Voltage Swing |IN-/IN| See Figure 1b. 0.2 V VT_IN IN-to-VT (IN, /IN) 1. 28 V VREF-AC Output Reference Voltage VCC-1.3 VCC-1.2 VCC-1.1 V Notes: 1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings conditions for extended periods may affect device reliability. 2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings. 3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB. θ JA and ΨJB values are determined for a 4-layer board in still air unless otherwise stated. 4. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. 5. VIN (max) is specified when VT is floating. |
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