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TC1277-10ENB Datasheet(PDF) 8 Page - Microchip Technology |
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TC1277-10ENB Datasheet(HTML) 8 Page - Microchip Technology |
8 / 12 page TC1275/TC1276/TC1277 DS21383C-page 8 © 2007 Microchip Technology Inc. 3-Lead Plastic Small Outline Transistor (TT or NB) [SOT-23] Notes: 1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side. 2. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units MILLIMETERS Dimension Limits MIN NOM MAX Number of Pins N 3 Lead Pitch e 0.95 BSC Outside Lead Pitch e1 1.90 BSC Overall Height A 0.89 – 1.12 Molded Package Thickness A2 0.79 0.95 1.02 Standoff A1 0.01 – 0.10 Overall Width E 2.10 – 2.64 Molded Package Width E1 1.16 1.30 1.40 Overall Length D 2.67 2.90 3.05 Foot Length L 0.13 0.50 0.60 Foot Angle φ 0° – 10° Lead Thickness c 0.08 – 0.20 Lead Width b 0.30 – 0.54 b N E E1 2 1 e e1 D A A1 A2 c L φ Microchip Technology Drawing C04-104B |
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