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AFBR-5803Z Datasheet(PDF) 7 Page - Agilent(Hewlett-Packard) |
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AFBR-5803Z Datasheet(HTML) 7 Page - Agilent(Hewlett-Packard) |
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7 / 16 page  7 Figure 8. Recommended Board Layout Hole Pattern Solder and Wash Process Compatibility The transceivers are delivered with protective process plugs inserted into the duplex SC or duplex ST connector receptacle. This process plug protects the optical subassemblies during wave solder and aqueous wash processing and acts as a dust cover during shipping. These transceivers are compat- ible with either industry standard wave or hand solder processes. Shipping Container The transceiver is packaged in a shipping container designed to protect it from mechanical and ESD damage during shipment or storage. Board Layout - Decoupling Circuit and Ground Planes It is important to take care in the layout of your circuit board to achieve optimum performance from these transceivers. Figure 7 provides a good example of a schematic for a power supply decoupling circuit that works well with these parts. It is further recommended that a contiguous ground plane be provided in the circuit board directly under the transceiver to provide a low inductance ground for signal return current. This recommendation is in keeping with good high frequency board layout practices. Board Layout - Hole Pattern The Agilent transceiver complies with the circuit board “Common Transceiver Footprint” hole pattern defined in the original multisource announcement which defined the 1 x 9 package style. This drawing is reproduced in Figure 8 with the addition of ANSI Y14.5M compliant dimensioning to be used as a guide in the mechanical layout of your circuit board. Board Layout - Mechanical For applications providing a choice of either a duplex SC or a duplex ST connector interface, while utilizing the same pinout on the printed circuit board, the ST port needs to protrude from the chassis panel a minimum of 9.53 mm for sufficient clearance to install the ST connector. Please refer to Figure 8a for a mechanical layout detailing the recommended location of the duplex SC and duplex ST transceiver packages in relation to the chassis panel. 20.32 (0.800) TOP VIEW 2 x Ø 1.9 ± 0.1 (0.075 ± 0.004) 20.32 (0.800) 2.54 (0.100) 9 x Ø 0.8 ± 0.1 (0.032 ± 0.004) DIMENSIONS ARE IN MILLIMETERS (INCHES) |
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