Copyright © 2006-2007 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree,

the Cree logo and XLamp are registered trademarks of Cree, Inc.

8

CLD-DS05.006

Cree, Inc.

4600 Silicon Drive

Durham, NC 27703

USA Tel: +1.919.313.5300

www.cree.com/xlamp

Reflow Soldering Characteristics

The following reflow soldering profiles are provided for reference. Cree recommends that users follow the recommended

soldering profile provided by the manufacturer of the solder paste used. Cree XLamp LEDs are compatible with JEDEC

J-STD-020C.

Profile Feature

Lead-Based Solder

Lead-Free Solder

Average Ramp-Up Rate (Ts

3°C/second max.

3°C/second max.

Preheat: Temperature Min (Ts

100°C

150°C

Preheat: Temperature Max (Ts

150°C

200°C

Preheat: Time (ts

60-120 seconds

60-180 seconds

Time Maintained Above: Temperature (T

183°C

217°C

Time Maintained Above: Time (t

60-150 seconds

60-150 seconds

Peak/Classification Temperature (Tp)

215°C

260°C

Time Within 5°C of Actual Peak Temperature (tp)

10-30 seconds

20-40 seconds

Ramp-Down Rate

6°C/second max.

6°C/second max

Time 25°C to Peak Temperature

6 minutes max.

8 minutes max.

Note: All temperatures refer to topside of the package, measured on the package body surface.