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BCN31 Datasheet(PDF) 2 Page - Bi technologies

Part No. BCN31
Description  R/2R Ladder Network 8 Bit, 2512 Size Thick Film Leadless Chip Packages
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Maker  BITECH [Bi technologies]
Homepage  http://www.bitechnologies.com
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BCN31 Datasheet(HTML) 2 Page - Bi technologies

   
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4-14
Model BCN31 Ladder
ENVIRONMENTAL
Moisture Resistance
1,000 hours at +40°C, 95% R.H. (3.0%
∆R)
High Temperature Operation
1,000 hours at 70°C (3.0%
∆R)
Short Time Overload
2.5 x rated voltage, 5 seconds (2.0%
∆R)
Temperature Cycling
-55°C to +125°C, 5 cycles (1.0%
∆R)
Resistance to Solder Heat
260°C for 10 seconds (1.0%
∆R)
Load Life
1,000 hours at 70°C (3.0%
∆R)
SCHEMATIC (Inch/mm)
R
10
987
6
1234
5
2R
2R
2R
2R
2R
2R
2R
2R
2R
RR
R
R
R
R
SOLDER PAD LAYOUT (Inch/mm)
PA
B
C
XY
A
B
C
X
Y
Wave Solder Process
Re-Flow Solder Process
C
P
Y
Y
A
X
X
B
.050
1.27
.084
2.10
.148
3.70
.014
0.35
.036
0.90
.032
0.80
.084
2.10
.148
3.70
.014
0.35
.036
0.90
.032
0.80


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