LX1973

Microsemi

Integrated Products Division

11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570

Page 6

Copyright

© 2004

Rev. 1.0 2006-01-04

Automotive Light Sensor

TM

®

PACKAGE DIMENSIONS

DU

8-Pin Miniature Shrink Outline Package (MSOP)

A1

L

E

L1

E1

b

e

S

A

D

Top View

Side Views

Dim

MIN

MAX

MIN

MAX

A

–

1.10

–

0.043

A1

0.05

0.15

0.002

0.006

b

0.26

0.41

0.010

0.016

c

0.13

0.23

0.005

0.009

D

2.90

3.10

0.114

0.122

e

0.65 BSC

0.025 BSC

E

4.75

5.05

0.187

0.198

E1

2.90

3.10

0.114

0.122

L

0.41

0.71

0.016

0.028

L1

0.95 BSC

0.037 BSC

S

0.525 BSC

0.021 BSC

Θ

3°

3°

Active Area

Required Minimum Light footprint

Bonding / Wafer area

Examination of

Active Area

Recommended light footprint pattern

P1

Active Area

B

C

L

C

(recommended)

Dim

A

1.22

0.048

a

0.85

0.033

B

0.60

0.024

C

0.60

0.024

P1

2.5

0.98

Note:

P1 represents a possible light footprint and its

dimensions are not subject to strict tolerances. Only

the active area of the device is required to be

covered with light. This larger footprint is designed to

ensure coverage of the device’s active area.