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LX1973 Datasheet(PDF) 6 Page - Microsemi Corporation |
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LX1973 Datasheet(HTML) 6 Page - Microsemi Corporation |
6 / 7 page LX1973 PRODUCTION DATA SHEET Microsemi Integrated Products Division 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 6 Copyright © 2004 Rev. 1.0 2006-01-04 Automotive Light Sensor TM ® PACKAGE DIMENSIONS DU 8-Pin Miniature Shrink Outline Package (MSOP) A1 L E L1 E1 b e S A D c Θ Top View Side Views MILLIMETERS INCHES Dim MIN MAX MIN MAX A – 1.10 – 0.043 A1 0.05 0.15 0.002 0.006 b 0.26 0.41 0.010 0.016 c 0.13 0.23 0.005 0.009 D 2.90 3.10 0.114 0.122 e 0.65 BSC 0.025 BSC E 4.75 5.05 0.187 0.198 E1 2.90 3.10 0.114 0.122 L 0.41 0.71 0.016 0.028 L1 0.95 BSC 0.037 BSC S 0.525 BSC 0.021 BSC Θ 3° 3° Active Area Required Minimum Light footprint Bonding / Wafer area Examination of Active Area Recommended light footprint pattern P1 Active Area B C L C (recommended) MILLIMETERS INCHES Dim A 1.22 0.048 a 0.85 0.033 B 0.60 0.024 C 0.60 0.024 P1 2.5 0.98 Note: P1 represents a possible light footprint and its dimensions are not subject to strict tolerances. Only the active area of the device is required to be covered with light. This larger footprint is designed to ensure coverage of the device’s active area. |
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