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TDA3674 Datasheet(PDF) 4 Page - NXP Semiconductors

Part No. TDA3674
Description  Low dropout voltage/quiescent current 5 V voltage regulator with enable
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Maker  PHILIPS [NXP Semiconductors]
Homepage  http://www.nxp.com
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TDA3674 Datasheet(HTML) 4 Page - NXP Semiconductors

 
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2000 Feb 01
4
Philips Semiconductors
Preliminary specification
Low dropout voltage/quiescent current 5 V
voltage regulator with enable
TDA3674
FUNCTIONAL DESCRIPTION
The TDA3674 is a fixed 5 V regulator which can deliver
output currents up to 100 mA. The regulator is available in
an SO8 package with fused centre pins connected to the
lead frame. The regulator is intended for portable, mains,
telephone and automotive applications. To increase the
lifetime of batteries, a specially built-in clamp circuit keeps
the quiescent current of this regulator very low, also in
dropout and full load conditions.
The regulator remains operating down to very low supply
voltages and below it switches off.
A temperature protection circuit is included, which
switches off the regulator output at a junction temperatures
above 150
°C.
A new output circuit guarantees the stability of the
regulator for a capacitor output circuit with an ESR up to
20
Ω. If only a 100 nF capacitor is used, the regulator is
fully stable when IREG > 200 µA. This is very attractive as
the ESR of an electrolytic capacitor increases strongly at
low temperatures (no expensive tantalum capacitor is
required).
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
THERMAL CHARACTERISTICS
QUALITY SPECIFICATION
In accordance with
“SNW-FQ-611E”.
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VP
supply voltage
TDA3674T
33
V
TDA3674AT
45
V
VP(rp)
reverse polarity supply voltage
non-operating
−−25
V
Ptot
total power dissipation
temperature of copper area
is 25
°C
4.1
W
Tstg
storage temperature
non-operating
−55
+150
°C
Tamb
ambient temperature
operating
TDA3674T
−40
+85
°C
TDA3674AT
−40
+125
°C
Tj
junction temperature
operating
−40
+150
°C
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth(j-a)
thermal resistance from junction to ambient
in free air; soldered
125
K/W
Rth(j-c)
thermal resistance from junction to case
to centre pins; soldered
30
K/W


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