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TDA3672 Datasheet(PDF) 4 Page - NXP Semiconductors

Part No. TDA3672
Description  Very low dropout voltage/quiescent current 3.0 V voltage regulator with enable
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Maker  PHILIPS [NXP Semiconductors]
Homepage  http://www.nxp.com
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TDA3672 Datasheet(HTML) 4 Page - NXP Semiconductors

 
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2000 Apr 26
4
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current
3.0 V voltage regulator with enable
TDA3672
FUNCTIONAL DESCRIPTION
The TDA3672 is a fixed 3.0 V regulator which can deliver
output currents up to 100 mA. The regulator is available in
an SO8 package with fused centre pins connected to the
lead frame. The regulator is intended for portable, mains,
telephone and automotive applications. To increase the
lifetime of batteries, a specially built-in clamp circuit keeps
the quiescent current of this regulator very low, also in
dropout and full load conditions.
The regulator remains operating down to very low supply
voltages and below this voltage it switches off.
A temperature protection circuit is included, which
switches off the regulator output at a junction temperature
above 150
°C.
A new output circuit guarantees the stability of the
regulator for a capacitor output circuit with an ESR up
to 20
Ω (see Fig.5). If only a 100 nF capacitor is used, the
regulator is fully stable when IREG > 200 µA. This is very
attractive as the ESR of an electrolytic capacitor increases
strongly at low temperatures (no expensive tantalum
capacitor is required).
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
THERMAL CHARACTERISTICS
QUALITY SPECIFICATION
In accordance with
“SNW-FQ-611E”.
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VP
supply voltage
45
V
VP(rp)
reverse polarity supply voltage
non-operating
−−25
V
Ptot
total power dissipation
temperature of copper area
is 25
°C
4.1
W
Tstg
storage temperature
non-operating
−55
+150
°C
Tamb
ambient temperature
operating
−40
+125
°C
Tj
junction temperature
operating
−40
+150
°C
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth(j-a)
thermal resistance from junction to ambient
in free air; soldered in
125
K/W
Rth(j-c)
thermal resistance from junction to case
to centre pins; soldered in
30
K/W


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