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PI3033B Datasheet(PDF) 2 Page - AMI SEMICONDUCTOR

Part No. PI3033B
Description  Contact Image Sensor
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Maker  AMI [AMI SEMICONDUCTOR]
Homepage  http://www.amis.com
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PI3033B Datasheet(HTML) 2 Page - AMI SEMICONDUCTOR

 
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Preliminary PI3033B datasheet
PI3033B
200DPI CIS Sensor Chip
Engineering Data Sheet
Description
:
Peripheral Imaging Corporation PI3033B CIS, Contact Image Sensor, chip is a 200 dot per
inch resolution, linear array image sensor chip. The sensor chip is processed with PIC’s
proprietary CMOS Image Sensing Technology. Designed for cascading multiple chips in a
series, the image sensor chips, using chip-on-board process, are bonded end-to-end on a
printed circuit board (PCB) in varying sensing array lengths. Accordingly offering image
reading widths to suit document scanners found in facsimile, scanner, check reader, and office
automation equipment.
Figure 1 is a block diagram of the imaging sensor chip. Each sensor chip consists of 64 detector
elements, their associated multiplexing switches, buffers, and a chip selector. The detector's element-
to-element spacing is approximately 125 um. The size of each chip without scribe lines is 7950 um by
500 um. Each sensor chip has 8 bonding pads. Only 7 are used to make the CIS Modules. The pad
symbols and functions are described in Table 1.
Figure 1. PI3033B Block Diagram
SYMBOL
FUNCTION
SP
Start Pulse: Input to start the line scan.
CP
Clock Pulse: Input to clock the Shift Register.
VDD
Positive Supply: +5 volt supply connected to substrate.
DGND
Digital Ground: Connection topside common
RSTLEV
A Bias Pad: Not used, left floating
IOUT
Signal Current Output: Output for video signal current
AGND
Analog Ground: Connection topside common
EOS
End of Scan Pulse: Output from the shift register at end of scan.
Buffer
SP
CP
VDD DGND
IOUT
RSTLEV
AGND EOS
Chip
Select
Buffer
Readout Shift Register
Row of 64 Sensors
and Video Signal
Multiplexers
Buffer
7950
m
500
m
Table 1. Pad Symbols and Functions
Page 2 of 13 Date: 03/18/05


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