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C1210C120KHRAC Datasheet(PDF) 4 Page - Kemet Corporation |
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C1210C120KHRAC Datasheet(HTML) 4 Page - Kemet Corporation |
4 / 9 page ©KEMET Electronics Corporation, P.O. Box 5928, Greenville, S.C. 29606, (864) 963-6300 CERAMIC CHIP / HIGH VOLTAGE C 0805 C 102 K C R A C Style C - Ceramic Chip Size 0805; 1206; 1210; 1808; 1812; 1825; 2220; 2225 Specification C - Standard Capacitance Code, pF First two digits represent significant figures. Third digit specifies number of zeros. 100 pF = 101. (Use “9” for 1.0 through 9.9 pF) (Use “8” for 0.1 through .99 pF) Capacitance Tolerance C = ±0.25pF* J = ±5% D = ±0.5pF* K = ±10% F = ±1%* M = ±20% G = ±2%* * Contact KEMET Sales for availability. Voltage C = 500V G = 2000V D = 1000V Z = 2500V F = 1500V H = 3000V Temperature Characteristic Designated by Capacitance Change over Temperature Range G – (C0G) (±30ppm/C) (-55°C +125°C) R – X7R (±15%) (-55°C +125°C) End Metallization C = Standard Failure Rate Level A = Not Applicable Capacitor Ordering Information Property Specification Capacitance C0G: 1 pF to 0.010 µF X7R: 10 pf to 0.22 µF 25°C, 1.0 ± 0.2 Vrms, 1 kHz (1 MHz for ≤ 1000 pF (C0G only) Cap Tolerance C0G: C*, D*, F*, G*, J, K, M * Contact KEMET Sales for availability. X7R: J, K, M DF C0G: 0.1% Max X7R: 2.5% Max Voltage Ratings 500 V, 1000 V, 1500 V, 2000 V, 2500 V, 3000 V Operating Temperature Range From -55C to +125C 25ºC IR @ 500V 100 G Ω or 1000 MΩ-µF, whichever is less 125ºC IR @ 500V 10 G Ω or 100 MΩ-µF, whichever is less -55ºC TCC +125ºC TCC X7R: + 15% C0G: + 30 ppm / ºC Dielectric Strength 150% of Rated Voltage for Rated Voltage <1000 V 120% of Rated Voltage for Rated Voltage >=1000V Ripple Current Consult KEMET Sales Representative Electrical Parameters Marking These chips are supplied unmarked. If required, they can be supplied LASER-marked at an extra cost. Packaging KEMET High Voltage Surface Mount MLCC are available packaged in tape and reel configuration, or bulk Soldering Process The 0805 and 1206 case sizes are suitable for either reflow or wave soldering processes. Sizes 1210 and larger should be limited to reflow soldering only. All sizes incorporate the standard KEMET barrier layer of pure nickel with an overplating of pure tin (Sn) for excellent solderability and resistance to solder leaching of Recommended Solder Pad Dimensions the termination. bag as outlined on page 8 3. Please consult factory for waffle packaging options. Details on the marking format is located on page 9 7. mm in. mm in. mm in. mm in. 0805 3.30 0.130 0.70 0.028 1.60 0.063 1.30 0.051 1206 4.50 0.177 1.50 0.059 2.00 0.079 1.50 0.059 1210 4.50 0.177 1.50 0.059 2.90 0.114 1.50 0.059 1808 5.90 0.232 2.30 0.091 2.40 0.094 1.80 0.071 1812 5.90 0.232 2.30 0.091 3.70 0.146 1.80 0.071 1825 5.90 0.232 2.30 0.091 6.90 0.272 1.80 0.071 2220 7.00 0.276 3.30 0.130 5.50 0.217 1.85 0.073 2225 7.00 0.276 3.30 0.130 6.80 0.268 1.85 0.073 L (Pad Length) Chip Size T (Total Length) S (Separation W (Pad Width) pF From -55ºC to +125ºC CAPACITOR ORDERING INFORMATION ELECTRICAL PARAMETERS MARKING PACKAGING SOLDERING PROCESS RECOMMENDED SOLDER PAD DIMENSIONS Style Chip Size Specification Capacitance Code, pF Capacitance Tolerance Voltage Temperature Characteristic Failure Rate Level End Metallization 84 |
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