13

This is a developmental specification and is subject to change without notice.

N256S0818HDA/N256S0830HDA

AMI Semiconductor, Inc.

Advance Information

8-Lead Plastic Small Outline, 150mil SOIC

Note:

1. All dimensions in Millimeters

2. Package dimensions exclude mold flash and protusions.

Parameter

Sym

Min

Nom

Max

Pin Pitch

p

1.27

Overall height

A

1.35

1.55

1.75

Molded Package Thickness

A2

1.32

1.42

1.55

Standoff

A1

0.10

0.18

0.25

Overall Width

E

5.79

6.02

6.20

Molded Package Width

E1

3.71

3.91

3.99

Overall Length

D

4.80

4.90

5.00

Chamfer Distance

h

0.25

0.38

0.51

Foot Length

L

0.48

0.62

0.76

Foot Angle

φ

04

8

Lead Thickness

c

0.20

0.23

0.25

Lead Width

B

0.33

0.42

0.51

Mold Draft Angle Top

α

012

15

Mold Draft Angle Bottom

β

012

15

E1

D

p

B

A2

A1

A

c

β

L

h

φ

α

E