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APTC60HM70T3G Datasheet(PDF) 3 Page - Microsemi Corporation |
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APTC60HM70T3G Datasheet(HTML) 3 Page - Microsemi Corporation |
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3 / 6 page 
APTC60HM70T3G www.microsemi.com 3 - 6 Thermal and package characteristics Symbol Characteristic Min Typ Max Unit RthJC Junction to Case Thermal Resistance 0.50 °C/W VISOL RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz 2500 V TJ Operating junction temperature range -40 150 TSTG Storage Temperature Range -40 125 TC Operating Case Temperature -40 100 °C Torque Mounting torque To heatsink M4 2.5 4.7 N.m Wt Package Weight 110 g Temperature sensor NTC (see application note APT0406 on www.microsemi.com for more information). Symbol Characteristic Min Typ Max Unit R25 Resistance @ 25°C 50 k Ω B 25/85 T25 = 298.15 K 3952 K − = T T B R R T 1 1 exp 25 85 / 25 25 SP3 Package outline (dimensions in mm) 12 1 See application note 1901 - Mounting Instructions for SP3 Power Modules on www.microsemi.com T: Thermistor temperature RT: Thermistor value at T |
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