SJA1000 datasheet(2/68 Pages) PHILIPS

Part #	SJA1000

Description	Stand-alone CAN controller

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Manufacturer	PHILIPS [NXP Semiconductors]

Direct Link	http://www.nxp.com

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2 / 68 page

2000 Jan 04

2

Philips Semiconductors

Product speciﬁcation

Stand-alone CAN controller

SJA1000

CONTENTS

1

FEATURES

2

GENERAL DESCRIPTION

3

ORDERING INFORMATION

4

BLOCK DIAGRAM

5

PINNING

6

FUNCTIONAL DESCRIPTION

6.1

Description of the CAN controller blocks

6.1.1

Interface Management Logic (IML)

6.1.2

Transmit Buffer (TXB)

6.1.3

Receive Buffer (RXB, RXFIFO)

6.1.4

Acceptance Filter (ACF)

6.1.5

Bit Stream Processor (BSP)

6.1.6

Bit Timing Logic (BTL)

6.1.7

Error Management Logic (EML)

6.2

Detailed description of the CAN controller

6.2.1

PCA82C200 compatibility

6.2.2

Differences between BasicCAN and PeliCAN

mode

6.3

BasicCAN mode

6.3.1

BasicCAN address layout

6.3.2

Reset values

6.3.3

Control Register (CR)

6.3.4

Command Register (CMR)

6.3.5

Status Register (SR)

6.3.6

Interrupt Register (IR)

6.3.7

Transmit buffer layout

6.3.8

Receive buffer

6.3.9

Acceptance filter

6.4

PeliCAN mode

6.4.1

PeliCAN address layout

6.4.2

Reset values

6.4.3

Mode Register (MOD)

6.4.4

Command Register (CMR)

6.4.5

Status Register (SR)

6.4.6

Interrupt Register (IR)

6.4.7

Interrupt Enable Register (IER)

6.4.8

Arbitration Lost Capture register (ALC)

6.4.9

Error Code Capture register (ECC)

6.4.10

Error Warning Limit Register (EWLR)

6.4.11

RX Error Counter Register (RXERR)

6.4.12

TX Error Counter Register (TXERR)

6.4.13

Transmit buffer

6.4.14

Receive buffer

6.4.15

Acceptance filter

6.4.16

RX Message Counter (RMC)

6.4.17

RX Buffer Start Address register (RBSA)

6.5

Common registers

6.5.1

Bus Timing Register 0 (BTR0)

6.5.2

Bus Timing Register 1 (BTR1)

6.5.3

Output Control Register (OCR)

6.5.4

Clock Divider Register (CDR)

7

LIMITING VALUES

8

THERMAL CHARACTERISTICS

9

DC CHARACTERISTICS

10

AC CHARACTERISTICS

10.1

AC timing diagrams

10.2

Additional AC information

11

PACKAGE OUTLINES

12

SOLDERING

12.1

Introduction

12.2

DIP

12.2.1

Soldering by dipping or by wave

12.2.2

Repairing soldered joints

12.3

SO

12.3.1

Reflow soldering

12.3.2

Wave soldering

12.3.3

Repairing soldered joints

13

DEFINITIONS

14

LIFE SUPPORT APPLICATIONS

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