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MACH220-10 Datasheet(PDF) 19 Page - Advanced Micro Devices |
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MACH220-10 Datasheet(HTML) 19 Page - Advanced Micro Devices |
19 / 33 page AMD 19 MACH220-10/12/15/20 TYPICAL THERMAL CHARACTERISTICS Measured at 25 °C ambient. These parameters are not tested. Parameter Symbol Parameter Description PLCC Units θjc Thermal impedance, junction to case 10 °C/W θja Thermal impedance, junction to ambient 33 °C/W θjma Thermal impedance, junction to 200 lfpm air 29 °C/W 400 lfpm air 27 °C/W 600 lfpm air 24 °C/W 800 lfpm air 23 °C/W Plastic θjc Considerations The data listed for plastic θjc are for reference only and are not recommended for use in calculating junction temperatures. The heat-flow paths in plastic-encapsulated devices are complex, making the θjc measurement relative to a specific location on the package surface. Tests indicate this measurement reference point is directly below the die-attach area on the bottom center of the package. Furthermore, θjc tests on packages are performed in a constant-temperature bath, keeping the package surface at a constant temperature. Therefore, the measurements can only be used in a similar environment. Typ ambient with air flow |
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