AMD

19

MACH220-10/12/15/20

TYPICAL THERMAL CHARACTERISTICS

Measured at 25

°C ambient. These parameters are not tested.

Parameter

Symbol

Parameter Description

PLCC

Units

Thermal impedance, junction to case

10

°C/W

Thermal impedance, junction to ambient

33

°C/W

Thermal impedance, junction to

200 lfpm air

29

°C/W

400 lfpm air

27

°C/W

600 lfpm air

24

°C/W

800 lfpm air

23

°C/W

Plastic

θjc Considerations

The data listed for plastic

θjc are for reference only and are not recommended for use in calculating junction temperatures. The

heat-flow paths in plastic-encapsulated devices are complex, making the

θjc measurement relative to a specific location on the

package surface. Tests indicate this measurement reference point is directly below the die-attach area on the bottom center of the

package. Furthermore,

θjc tests on packages are performed in a constant-temperature bath, keeping the package surface at a

constant temperature. Therefore, the measurements can only be used in a similar environment.

Typ

ambient with air flow