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Multilayer ceramic capacitors

Cautions and warnings

The following should be considered in the placement process

1. Ensure correct positioning of the ceramic capacitor on the solder pad.

2. Caution when using casting, injection-molded and molding compounds and cleaning agents,

as these may damage the capacitor.

3. Support the circuit board and reduce the placement forces.

4. A board should not be straightened (manually) if it has been distorted by soldering.

5. Separate panels with a peripheral saw, or better with a milling head (no dicing or breaking).

6. Caution in the subsequent placement of heavy or leaded components (e.g. transformers or

snap-in components): danger of bending and fracture.

7. When testing, transporting, packing or incorporating the board, avoid any deformation of the

board not to damage the components.

8. Avoid the use of excessive force when plugging a connector into a device soldered onto the

board.

9. Ceramic capacitors must be soldered only by the mode (reflow or wave soldering) permissible

for them (see the chapter “Soldering directions”).

10. When soldering the most gentle solder profile feasible should be selected (heating time, peak

temperature, cooling time) in order to avoid thermal stresses and damage.

11. Ensure the correct solder meniscus height and solder quantity.

12. Ensure correct dosing of the cement quantity.

13. Ceramic capacitors with an AgPd external termination are not suited for the lead-free solder

process: they were developed only for conductive adhesion technology.

This listing does not claim to be complete, but merely reflects the experience of EPCOS AG.