6

Sheet No.: D3-A04601EN

GP1A73AJ000F

■ Design Considerations

● Design guide

1) Prevention of detection error

To prevent photointerrupter from faulty operation caused by external light, do not set the detecting face to

the external light.

GND near the device.

3) When the sensor is connected with long wire, noise might be on the signal from the sensor while it is

going through the wire. To avoid this problem, please evaluate the sensor under actual usage condition to

make sure that the system works fine.

4) Position of opaque board

Opaque board shall be installed at place 4mm or more from the top of elements.

(Example)

4mm or more

This product is not designed against irradiation and incorporates non-coherent IRED.

● Parts

This product is assembled using the below parts.

Category

Material

Maximum Sensitivity

wavelength (nm)

Sensitivity

wavelength (nm)

Response time (μs)

Photo

diode

Silicon (Si)

900

400 to 1 200

10

• Photo emitter (qty. : 1)

Category

Material

Maximum light emitting

wavelength (nm)

I/O Frequency (MHz)

Infrared emitting diode

(non-coherent)

Gallium arsenide (GaAs)

940

0.3

• Material

Case

Lead frame

Connector terminal finish

Black polycarbonate resin

(UL94V-2)

42Alloys

(There is no plating)

Sn plating (PN : 292133-3)

SnCu plating (PN : GH4A003P000ZA)

• Others

Laser generator is not used.